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Space charge and DC dielectric breakdown in polymeric insulation

机译:聚合物绝缘中的空间电荷和DC介电击穿

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摘要

many years but the mechanisms that cause breakdown have not been fully understood. Charge injection always occurs at high electric fields and especially under dc conditions. The presence of space charge in solid dielectrics will result in distortion of electric field distribution. Dielectric breakdown can be initiated in the region where electric field enhancement takes place if the electric field exceeds the “threshold strength” of the material. Evidence of the presence of “threshold strength” has emerged from recent experimental work. In the present paper, a new model based on space charge dynamics under very high dc electric field has been proposed. Bipolar charge injection model has been successful in simulating charge dynamics in polymeric insulation under dc conditions. By setting threshold strength it is possible to achieve dielectric breakdown when the applied voltage rises linearly with time. Based on the time to dielectric breakdown (TTDB), it is possible to calculate the applied electric field at which breakdown occurs. Our simulation results clearly show that the dielectric breakdown under dc conditions is dependent on the sample thickness and voltage rising rate, i.e. the applied electric field at which the breakdown occurs decreases with sample thickness and increases with voltage rising rate. Both effects have been clearly observed in practical dc breakdown tests but the mechanisms never properly understood. The new model also allows one to examine charge dynamics prior to breakdown and influential factors that govern charge dynamics in the polymeric insulation, therefore, provides a strategy of how to improve dielectric performance of polymeric insulation.
机译:许多年,但导致故障的机制尚未完全了解。电荷注入总是在高电场下发生,尤其是在直流条件下。固体电介质中存在空间电荷会导致电场分布失真。如果电场超过材料的“阈值强度”,则会在发生电场增强的区域引发介电击穿。最近的实验工作已经证明存在“阈值强度”。本文提出了一种基于极高直流电场下空间电荷动力学的新模型。双极性电荷注入模型已经成功地模拟了直流条件下聚合物绝缘中的电荷动力学。通过设置阈值强度,可以在施加的电压随时间线性上升时实现电介质击穿。根据介电击穿时间(TTDB),可以计算发生击穿的施加电场。我们的仿真结果清楚地表明,直流条件下的电介质击穿取决于样品厚度和电压上升速率,即发生击穿的施加电场随样品厚度的增加而减小,并随电压上升速率的增加而增加。在实际的直流击穿测试中都清楚地观察到了这两种效应,但其机理从未得到正确理解。新模型还允许人们在击穿之前检查电荷动态以及控制聚合物绝缘中电荷动态的影响因素,因此,提供了一种如何改善聚合物绝缘介电性能的策略。

著录项

  • 作者

    Chen George; Zhao Junwei;

  • 作者单位
  • 年度 2012
  • 总页数
  • 原文格式 PDF
  • 正文语种 {"code":"en","name":"English","id":9}
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