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MOOSE: A Physically Based Compact DC Model of SOI LDMOSFETs for Analogue Circuit Simulation

机译:mOOsE:用于模拟电路仿真的sOI LDmOsFET的基于物理的紧凑型DC模型

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摘要

In this paper, we present a compact model for silicon-on-insulator (SOI) laterally double diffused (LD) MOSFETs. The model is complete insofar as it uses no subcircuits, and is intended to predict device operation in all regions of bias. The device current is described by two main equations handling the MOS channel and the drift region, both of which are smooth and continuous in all operating regimes. Attention is also given to the modelling of inversion at the back oxide to ensure correct behavior is predicted for a source follower in power control applications ("high side operation"). A surface-potential-based formulation is used for the inversion/accumulation channel giving smooth transitions between different regions of operation, and care has been taken to ensure all expressions are smooth and infinitely differentiable to achieve the best possible convergence performance. Self (and coupled) heating effects exert a major influence over the behavior of power SOI devices, and these issues are incorporated in the model core in a consistent fashion. The model has been installed in a commercial SPICE-type circuit simulator and evaluated against individual devices and complete circuits fabricated in an industrial smart power SOI process. Accuracy is significantly improved with respect to the existing LDMOS models, and convergence behavior in switching and linear circuit simulations is comparable with industry standard models of this complexity.
机译:在本文中,我们为绝缘体上硅(SOI)横向双扩散(LD)MOSFET提供了一个紧凑模型。该模型在不使用任何子电路的情况下是完整的,旨在预测所有偏置区域的器件工作情况。器件电流由处理MOS沟道和漂移区的两个主要方程式描述,这两个方程式在所有工作状态下都是平滑且连续的。还应注意对背面氧化物的反演建模,以确保在功率控制应用(“高压侧操作”)中为源极跟随器预测正确的行为。基于表面电势的公式用于反转/累加通道,可在不同操作区域之间实现平滑过渡,并且已采取措施确保所有表达式都平滑且无穷微,以实现最佳的收敛性能。自(和耦合)热效应对功率SOI器件的行为产生重大影响,并且这些问题以一致的方式并入模型核心。该模型已安装在商用SPICE型电路仿真器中,并针对工业智能电源SOI工艺中制造的单个设备和完整电路进行了评估。相对于现有的LDMOS模型,精度得到了显着提高,并且开关和线性电路仿真中的收敛性能可与这种复杂性的行业标准模型相提并论。

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