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Characterisation of CMOS compatible vertical MOSFETs with new architectures through EKV parameter extraction and RF measurement

机译:通过EKV参数提取和RF测量,对具有新架构的CmOs兼容垂直mOsFET进行表征

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摘要

Vertical MOSFETs (VMOSFETs) with channel lengths down to 100nm and reduced overlap parasitic capacitance were fabricated using 0.35?m lithography, with only one extra mask step compared to standard CMOS technology. EKV modelling produced reasonable fitting of the DC and AC characteristics for short channel devices. It is noted that achieving sufficiently long channels in vertical pillar devices is difficult and introduces challenges for accurate and scalable compact modelling. The measured peak fT was 7.8 GHz and is significantly limited by high contact resistance and affected by unoptimised junction formation. The study comprehensively reveals structure issues that affect the RF performance. The performance inhibitors have then been optimised using process and device simulation. It is demonstrated that fT and fMAX based on the measurement and numerical simulation, can reach 30.5GHz, and 41GHz respectively.
机译:使用0.35?m光刻技术制造沟道长度低至100nm并减小了重叠寄生电容的垂直MOSFET(VMOSFET),与标准CMOS技术相比,仅需增加一个掩模步骤。 EKV建模可以合理地拟合短通道设备的DC和AC特性。注意,在垂直支柱设备中实现足够长的通道是困难的,并且为精确和可伸缩的紧凑建模带来了挑战。测得的峰值fT为7.8 GHz,并受到高接触电阻的明显限制,并受到未优化结形成的影响。该研究全面揭示了影响射频性能的结构问题。然后,使用过程和设备模拟对性能抑制剂进行了优化。通过测量和数值模拟表明,fT和fMAX分别可以达到30.5GHz和41GHz。

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