Transition from multiple to single microcontact conduction during hot switching of microelectromechanical switches with ball-shaped dimples

摘要

Previous studies of electron transport within direct contact microelectromechanical switches have found that conduction occurs via nanoscale contact asperities. It has been claimed that reduced contact resistance can be achieved by using multiple contact switches; however, the ability of these switches to enhance power handling or lifetime remains a question. To study the contact mechanism, single-input-multiple-output switches with ball-shaped dimples were specially designed and tested. At all voltage levels of hot-switching operation, uneven current sharing among the outputs was observed. Furthermore, at softening voltage, an irreversible multiple to single conduction transition occurs and is found to alternate among different outputs.