Notes on Computational Methodology and Tools of Thermoelectric Energy Systems

摘要

The SPICE model allows the concurrent simulation of thermoelectric devices and application electric sub-models. It is an important step to implement the thermoelectric modeling at the system level. In this paper, temperature dependent material properties in the SPICE model, temperature and heat flow obtained by the code ANSYS Multiphysics and SPICE (Simulation Program with Integrated Circuit Emphasis), as well as some notes on the 3-D extension of the SPICE model are introduced.