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Template-assisted selective epitaxy of III-V nanoscale devices for co-planar heterogeneous integration with Si

机译:用于与si共面非均相整合的III-V纳米级器件的模板辅助选择性外延

摘要

III-V nanoscale devices were monolithically integrated on silicon-on-insulator (SOI) substrates by template-assisted selective epitaxy (TASE) using metal organic chemical vapor deposition. Single crystal III-V (InAs, InGaAs, GaAs) nanostructures, such as nanowires, nanostructures containing constrictions, and cross junctions, as well as 3D stacked nanowires were directly obtained by epitaxial filling of lithographically defined oxide templates. The benefit of TASE is exemplified by the straightforward fabrication of nanoscale Hall structures as well as multiple gate field effect transistors (MuG-FETs) grown co-planar to the SOI layer. Hall measurements on InAs nanowire cross junctions revealed an electron mobility of 54002/V s, while the alongside fabricated InAs MuG-FETs with ten 55 nm wide, 23 nm thick, and 390 nm long channels exhibit an on current of 660 μA/μm and a peak transconductance of 1.0 mS/μm at VDS = 0.5 V. These results demonstrate TASE as a promising fabrication approach for heterogeneous material integration on Si.
机译:通过使用金属有机化学气相沉积的模板辅助选择性外延(TASE),将III-V纳米级器件单片集成在绝缘体上硅(SOI)衬底上。通过外延填充光刻定义的氧化物模板可直接获得单晶III-V(InAs,InGaAs,GaAs)纳米结构,例如纳米线,包含缩颈和交叉结的纳米结构,以及3D堆叠纳米线。 TASE的优势体现在纳米级霍尔结构的直接制造以及与SOI层共面生长的多个栅场效应晶体管(MuG-FET)。在InAs纳米线交叉结上进行的霍尔测量显示出电子迁移率为54002 / V s,同时制造的具有十个55 nm宽,23 nm厚和390 nm长沟道的InAs MuG-FET的导通电流为660μA/μm,在VDS = 0.5 V时,峰值跨导为1.0 mS /μm。这些结果证明TASE是一种有希望的制造方法,用于在Si上进行异质材料集成。

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