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A dilute Cu(Ni) alloy for synthesis of large-area Bernal satcked bilayer graphene using atmospheric pressure chemical vapour deposition

机译:稀释Cu(Ni)合金,用于使用常压化学气相沉积合成大面积Bernal satcked双层石墨烯

摘要

A bilayer graphene film obtained on copper (Cu) foil is known to have a significant fraction ofnon-Bernal (AB) stacking and on copper/nickel (Cu/Ni) thin films is known to grow over alarge-area with AB stacking. In this study, annealed Cu foils for graphene growth were doped withsmall concentrations of Ni to obtain dilute Cu(Ni) alloys in which the hydrocarbon decompositionrate of Cu will be enhanced by Ni during synthesis of large-area AB-stacked bilayer grapheneusing atmospheric pressure chemical vapour deposition. The Ni doped concentration and the Nihomogeneous distribution in Cu foil were confirmed with inductively coupled plasma opticalemission spectrometry and proton-induced X-ray emission. An electron backscatter diffractionmap showed that Cu foils have a single (001) surface orientation which leads to a uniform growthrate on Cu surface in early stages of graphene growth and also leads to a uniform Ni surfaceconcentration distribution through segregation kinetics. The increase in Ni surface concentrationin foils was investigated with time-of-flight secondary ion mass spectrometry. The quality of graphene,the number of graphene layers, and the layers stacking order in synthesized bilayer graphenefilms were confirmed by Raman and electron diffraction measurements. A four point probe stationwas used to measure the sheet resistance of graphene films. As compared to Cu foil, the prepareddilute Cu(Ni) alloy demonstrated the good capability of growing large-area AB-stacked bilayergraphene film by increasing Ni content in Cu surface layer.
机译:已知在铜(Cu)箔上获得的双层石墨烯薄膜具有很大的非伯纳(AB)堆叠,而在铜/镍(Cu / Ni)薄膜上通过AB堆叠可在大面积上生长。在这项研究中,用低浓度的Ni掺杂用于石墨烯生长的退火Cu箔以获得稀薄的Cu(Ni)合金,其中大气压AB化学合成大面积AB堆叠双层石墨烯期间,Ni将提高Cu的烃分解率。气相沉积。通过电感耦合等离子体发射光谱和质子诱导的X射线发射确认了Cu箔中的Ni掺杂浓度和均匀分布。电子背散射衍射图显示,铜箔具有单一(001)的表面取向,这导致在石墨烯生长的早期阶段,铜表面上的生长速率均匀,并且还通过偏析动力学导致了均匀的镍表面浓度分布。用飞行时间二次离子质谱法研究了箔中镍表面浓度的增加。通过拉曼和电子衍射测量证实了合成双层石墨烯薄膜中石墨烯的质量,石墨烯层数以及层堆叠顺序。四点探针台用于测量石墨烯薄膜的薄层电阻。与Cu箔相比,制备的稀Cu(Ni)合金具有通过增加Cu表层中Ni含量来生长大面积AB堆叠的双层石墨烯膜的良好能力。

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