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Matkapuhelimessa käytettävän inkjet-tulostetun taipuisan piirilevyn analyysi

机译:用于手机的喷墨印刷柔性电路板分析

摘要

Flexible circuit boards are becoming more and more common in small and lightweight consumer electronics devices. Manufacturers are seeking novel technologies for flexible circuit manufacturing. Cost-effciency, environmental effects of the manufacturing technology and reducing process steps in manufacturing are the key drivers for development. Printed electronics, especially inkjet technology, has been an emerging viable candidate for flexible circuit board manufacturing over the last few years. Additive processing, minimal material consumption and digitally guided processing are the main attractors of inkjet printing technology. The objective of this thesis work is to demonstrate a flexible circuit board of a commercial mobile phone with inkjet printing technology. The design of the flexible printed circuit board is transferred to inkjet printing technology. The assembly process of the flex module is presented, including laser processing of the substrate, inkjet printing of the circuit layout, component attachment using isotropically conductive adhesive and epoxy and circuit coating. The end result is a flexible circuit, similar to the original design, produced with a new manufacturing technology. The inkjet printed demonstrators were then electrically tested by the original manufacturer of the device. Testing showed that functional prototypes with close to the same performance of the original devices were manufactured. The target of the thesis work was reached. Functional demonstrators with good performance were manufactured with inkjet printing technology. As other outcome knowledge of manufacturing electronics with inkjet printing was further increased, as methods for the design and assembly phase were developed. A specifc image masking algorithm for processing of the inkjet printer bitmap images was introduced in the device design phase. Method for making vias on substrate with inkjet printing technology was demonstrated. Also a method for component attachment on flexible inkjet printed circuits was demonstrated. /Kir11
机译:柔性电路板在小型轻巧的消费电子设备中变得越来越普遍。制造商正在寻求用于柔性电路制造的新颖技术。成本效率,制造技术对环境的影响以及减少制造中的工艺步骤是发展的主要动力。在过去的几年中,印刷电子技术,尤其是喷墨技术,已经成为柔性电路板制造的新兴可行候选人。增材加工,最小的材料消耗和数字引导加工是喷墨打印技术的主要吸引力。本文工作的目的是演示具有喷墨打印技术的商用手机的柔性电路板。柔性印刷电路板的设计已转移到喷墨印刷技术中。介绍了柔性模块的组装过程,包括基板的激光加工,电路布局的喷墨印刷,使用各向同性导电胶以及环氧树脂和电路涂层的组件附接。最终结果是采用新的制造技术生产的类似于原始设计的柔性电路。然后,由设备的原始制造商对喷墨打印的演示器进行电测试。测试表明,已制造出性能与原始设备几乎相同的功能原型。达到了论文工作的目标。具有良好性能的功能演示器是使用喷墨打印技术制造的。随着设计和组装阶段方法的发展,利用喷墨印刷制造电子产品的其他成果知识进一步增加。在设备设计阶段,引入了用于处理喷墨打印机位图图像的特定图像掩蔽算法。阐述了利用喷墨印刷技术在基板上制作通孔的方法。还展示了用于在柔性喷墨印刷电路上的部件附接的方法。 / Kir11

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    Koskinen Santtu;

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  • 年度 2011
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