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High-Throughput Multiple Dies-to-Wafer Bonding Technology and III/V-on-Si Hybrid Lasers for Heterogeneous Integration of Optoelectronic Integrated Circuits

机译：用于光电集成电路异构集成的高通量多晶片到晶圆键合技术和III / V-on-si混合激光器

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Xianshu Luo; Yulian Cao; Junfeng Song; Xiaonan Hu; Yuanbing Cheng; Chengming Li; Chongyang Liu; Tsung-Yang Liow; Mingbin Yu; Hong Wang; Qi Jie Wang; Patrick Guo-Qiang Lo;
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1. High-Throughput Multiple Dies-to-Wafer Bonding Technology and III/V-on-Si Hybrid Lasers for Heterogeneous Integration of Optoelectronic Integrated Circuits [J] . Luo Xianshu, Cao Yulian, Song Junfeng, Frontiers in Materials . 2015,第4期

机译：高通量多管芯晶片键合技术和III / V-on-Si混合激光器，用于光电集成电路的异构集成
2. Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems [J] . Lee K.-W.Noriki A.Kiyoyama K.Fukushima T.Tanaka T.Koyanagi M. Electron Devices, IEEE Transactions on . 2011,第3期

机译：用于光电异构系统的CMOS，MEMS和光子电路的三维混合集成技术
3. Assembly and Electrical Wiring Technologies on Planar Lightwave Circuit (PLC) Platform Providing Hybrid Integration of Optoelectronic Devices and Integrated Circuits (ICs) [J] . Takaharu OHYAMA, Yuji AKAHORI, Masahiro YANAGISAWA IEICE Transactions on Communications . 1999,第2期

机译：平面光波电路（PLC）平台上的组装和电气布线技术，可实现光电子器件和集成电路（IC）的混合集成
4. High-throughput multiple dies-to-wafer (D2W) bonding for III/V-on-Si hybrid lasers [C] . Xianshu Luo, Yulian Cao, Junfeng Song, Optical Fiber Communications Conference and Exhibition . 2015

机译：III / V-on-Si混合激光器的高通量多晶片对晶片（D2W）接合
5. Tunable Lasers with Ring-based Mirrors for Photonic Integrated Circuits on Heterogeneous Silicon-III/V. [D] . Hulme, Jared. 2016

机译：具有异质硅III / V上光子集成电路的带环形镜的可调谐激光器。
6. III/V-on-Si MQW lasers by using a novel photonic integration method of regrowth on a bonding template [O] . Yingtao Hu, Di Liang, Kunal Mukherjee, 2019

机译：通过使用新型光子集成方法在键合模板上再生III / V-on-Si MQW激光器
7. High-Throughput Multiple Dies-to-Wafer Bonding Technology and III/V-on-Si Hybrid Lasers for Heterogeneous Integration of Optoelectronic Integrated Circuits [O] . Xianshu eLuo, Yulian eCao, Junfeng eSong, 2015

机译：用于光电集成电路异构集成的高通量多晶片到晶圆键合技术和III / V-on-si混合激光器

High-Throughput Multiple Dies-to-Wafer Bonding Technology and III/V-on-Si Hybrid Lasers for Heterogeneous Integration of Optoelectronic Integrated Circuits

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