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Electrochemical deposition of a copper carboxylate layer on copper as potential corrosion inhibitor

机译:在铜上电化学沉积铜羧酸盐层作为潜在的腐蚀抑制剂

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摘要

Carboxylic acids and sodium carboxylates are used to protect metals against aqueous and atmospheric corrosion. In this paper we describe the application of a layer of copper carboxylate on the surface of a copper electrode by means of cyclic voltammetry technique, and tests which measure the corresponding resistance to aqueous corrosion. Unlike the soaking process, which also forms a film on the surface, the use of cyclic voltammetry allows one to follow the deposition process of the copper carboxylates onto the electrode. The modified electrodes have been characterized with infrared spectroscopy. In addition the corrosion resistance of the film has been investigated using polarization resistance and Tafel plot measurements.
机译:羧酸和羧酸钠用于保护金属免受水和大气腐蚀。在本文中,我们描述了通过循环伏安法在铜电极表面上应用一层羧酸铜的方法,并测试了相应的耐水腐蚀性能的测试方法。与在表面上也形成薄膜的浸泡过程不同,使用循环伏安法可以跟踪羧酸铜在电极上的沉积过程。修饰的电极已经通过红外光谱表征。另外,已经使用极化电阻和Tafel图测量研究了膜的耐腐蚀性。

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