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On the plasma chemistry of CH4-H2-Ar system relevant to diamond deposition process by plasma enhanced chemical vapor deposition

机译:用等离子体增强化学气相沉积法研究CH4-H2-ar体系与金刚石沉积过程相关的等离子体化学

摘要

Diamond films are extensively deposited using plasma enhanced chemical vapor deposition (PECVD). In this work, the most important non-neutral plasma surface processes, which are needed to analyze the deposition mechanism of diamond films from plasma gas phase, are considered. Moreover, the role of ionic species, which is mostly neglected in deposition investigations, has been considered. To analyze the diamond deposition process, we use the reaction probability algorithm for different surface phenomena. Then, using different methods like Motz and Wise modified relation, the reaction probability is transformed to the mass action kinetic rate constant. Our results lead to the calculation of rate coefficients for non-neutral gas-surface reactions that take place during the diamond deposition from plasma in CH4-H-2-Ar system.
机译:使用等离子体增强化学气相沉积(PECVD)广泛沉积金刚石膜。在这项工作中,考虑了最重要的非中性等离子表面处理,这是分析等离子气相金刚石薄膜沉积机理所必需的。此外,已经考虑了在沉积研究中通常被忽略的离子种类的作用。为了分析金刚石沉积过程,我们针对不同的表面现象使用了反应概率算法。然后,使用Motz和Wise修改关系之类的不同方法,将反应概率转换为质量作用动力学速率常数。我们的结果导致计算了在CH4-H-2-Ar系统中从等离子体沉积金刚石过程中发生的非中性气体表面反应的速率系数。

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