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Numerical Simulations of Microstructural Evolution of Lamellar Alloys: Applications to Pb-Sn Solder

机译：层状合金微观组织演变的数值模拟：pb-sn焊料的应用

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Rifa J. El-khozondar; Vitcheslav S. Solomatov; Veena Tikare;
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1. Microstructural Evolution in the Sn-Cu-Ni and Pb-Sn Solder Joints with Cu and Pt-Ag Metallized Al_2O_3 Substrate [J] . C.C. Young, J.G. Duh, S.Y. Tsai Journal of Electronic Materials . 2001,第9期

机译：Cu和Pt-Ag金属化的Al_2O_3衬底在Sn-Cu-Ni和Pb-Sn焊点中的显微组织演变
2. Numerical Prediction of Mechanical Properties of Pb-Sn Solder Alloys Containing Antimony, Bismuth and or Silver Ternary Trace Elements [J] . SHIVA P. GADAG, SUSANT PATRA Journal of Electronic Materials . 2000,第12期

机译：含锑，铋和/或银三元微量元素的Pb-Sn锡合金力学性能的数值预测
3. Numerical Prediction of Mechanical Properties of Pb-Sn Solder Alloys Containing Antimony, Bismuth and or Silver Ternary Trace Elements [J] . SHIVA P. GADAG, SUSANT PATRA Journal of Electronic Materials . 2000,第12期

机译：含锑，铋和/或银三元微量元素的Pb-Sn锡合金力学性能的数值预测
4. Numerical Simulations of Microstructural Evolution of Lamellar Alloys: Applications to Pb-Sn Solder [C] . Rifa J. El-Khozondar, Vitcheslav S. Solomatov, Veena Tikare Symposium on Modeling and Numerical Simulation of Materials Behavior and Evolution, Apr 2-5, 2002, San Francisco, California . 2002

机译：层状合金微观组织演变的数值模拟：在铅锡焊料中的应用
5. Diffusion driven microstructural evolution and its effect on mechanical behavior of SnAgCu solder alloys [D] . Chavali, Sri Chaitra Jyotsna. 2012

机译：扩散驱动的微观结构演化及其对SnAGCU焊料合金力学行为的影响
6. Forging property processing map and mesoscale microstructural evolution modeling of a Ti-17 alloy with a lamellar (α+β) starting microstructure [O] . Hiroaki Matsumoto, Daiki Naito, Kento Miyoshi, 2017

机译：具有片状（α+β）起始组织的Ti-17合金的锻造性能加工图和中尺度组织演变建模
7. Characteristics of Rapid Solidified Pb-Sn Alloy Wires and Their Application to Solder Bump for Fine Junction [O] . Toshinori Ogashiwa, Akihisa Inoue 1994

机译：快速凝固PB-SN合金电线的特性及其在精细交界处焊接凸起的应用

Numerical Simulations of Microstructural Evolution of Lamellar Alloys: Applications to Pb-Sn Solder

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