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Influence of body-tied and floating-body structure in double gate vertical n-MOSFET

机译:体结和浮体结构对双栅垂直n-MOSFET的影响

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摘要

The body-tied, BT DGVMOS and floating-body, FB DGVMOS devices have become an alternative solution for controlling short channel effects (SCEs). The influence of both structures in Double-Gate Vertical MOSFET (DG VMOS) will affect the device performance. For this purpose, both device structures, body-tied and floating-body DG VMOS have been developed and analytically compared by using Silvaco TCAD simulation tools. The simulations made for various substrate concentrations, Nsub(9×1017, 5×1017 and 1×1017cm-3) to be varied with different channel length, Lg (90, 50, and 30 nm). The electrical characteristic and SCEs of Threshold Voltage, Vth, Drain Induced Barrier Lowering (DIBL), Sub-threshold Swing (SS), and Current Ratio (Ion/Ioff) for both proposed device structures were investigated. According to TCAD simulation results, these respective results have been achieved, 20 mV/V of DIBL, and more than 107Ion/Ioff current ratio. The excellent subthreshold swing (~60 mV/dec) of the BT DGVMOS device is also attractive and it offers better electrical characteristics and thus improves the short channel effects (SCEs) compared to the FB DGVMOS device. Hence, it is believed that the BT DGVMOS device can become of the candidates for future nanoscale device.
机译:体贴式BT DGVMOS和浮体式FB DGVMOS器件已成为控制短通道效应(SCE)的替代解决方案。双栅极垂直MOSFET(DG VMOS)中两种结构的影响都会影响器件性能。为此,已经开发了两种器件结构,即体式和浮体DG VMOS,并使用Silvaco TCAD仿真工具进行了分析比较。对各种底物浓度Nsub(9×1017、5×1017和1×1017cm-3)进行的仿真随通道长度Lg(90、50和30 nm)的变化而变化。研究了两种器件结构的阈值电压,Vth,漏极感应势垒降低(DIBL),亚阈值摆幅(SS)和电流比(Ion / Ioff)的电气特性和SCE。根据TCAD仿真结果,已经获得了这些各自的结果,DIBL为20 mV / V,电流比大于107Ion / Ioff。 BT DGVMOS器件出色的亚阈值摆幅(〜60 mV / dec)也很有吸引力,并且与FB DGVMOS器件相比,它具有更好的电气特性,因此改善了短沟道效应(SCE)。因此,相信BT DGVMOS器件可以成为未来纳米级器件的候选者。

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