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Electronic conduction processes in amorphous silicon-carbon thin films prepared by RF magnetron sputtering

机译:射频磁控溅射制备非晶硅碳薄膜中的电子传导过程

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摘要

Thin films of amorphous silicon-carbon alloy (a-Si:C:H) were prepared by RF magnetron sputtering onto glass substrates maintained at room temperature. Aluminium (Al) electrodes were provided by thermal evaporation to form sandwich structures. The amorphous state of the films was confirmed by XRD analysis and their constituent was checked using FT-IR SystemSpectrum machine. Capacitance measurements indicate that the films have a relative permittivity value of 6.93. A detailed study of dark current-voltage (I-V) characteristics clearly reveals the conduction mechanism as ohmic at low voltages and that of trap limited space charge limited conduction (SCLC) at higher voltages. Further evidence for space-charge-limited conduction process is provided by a linear dependence of log I on log d, log Vx on log d and log VTFL on log d. The trap density is found in the order of 1021 m-3.
机译:通过RF磁控溅射在保持室温的玻璃基板上制备非晶硅碳合金(a-Si:C:H)的薄膜。通过热蒸发提供铝(Al)电极以形成夹心结构。通过XRD分析确认膜的非晶态,并使用FT-IR SystemSpectrum机器检查其组成。电容测量表明,薄膜的相对介电常数值为6.93。对暗电流-电压(I-V)特性的详细研究清楚地揭示了在低电压下为欧姆性的导电机制,以及在高电压下为陷阱受限的空间电荷受限的导电(SCLC)的机制。 log I对log d,log Vx对log d和log VTFL对log d的线性相关性提供了空间电荷受限传导过程的进一步证据。陷阱密度约为1021 m-3。

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