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Effect of Geometry and Temperature Cycle on the Reliability of WLCSP Solder Joints

机译：几何和温度循环对WLCsp焊点可靠性的影响

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Satish C. Chaparala; Brian D. Roggeman; James M. Pitarresi; Bahgat G. Sammakia; John Jackson; Garry Griffin; Tom Mchugh;
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1. Effect of Geometry and Temperature Cycle on the Reliability of WLCSP Solder Joints [J] . Satish C. Chaparala, Brian D. Roggeman, James M. Pitarresi, IEEE Transactions on Components and Packaging Technologies . 2005,第3期

机译：几何形状和温度循环对WLCSP焊点可靠性的影响
2. Improving WLCSP Reliability through Solder Joint Geometry Optimization [J] . Boyd Rogers, Chris Scanlan Advancing Microelectronics . 2014,第1期

机译：通过焊点几何优化提高WLCSP可靠性
3. Solder Joint Reliability of SnAgCu Solder Refinished Components Under Temperature Cycling Test [J] . Wang W., Osterman M., Das D., Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2011,第5期

机译：温度循环测试下SnAgCu焊料精加工组件的焊点可靠性
4. Effects of geometry and temperature cycle on the reliability of WLCSP solder joints [C] . Chaparala, S.C., Rogemann, . 2004

机译：几何形状和温度循环对WLCSP焊点可靠性的影响
5. Solder joint reliability of tin and tin-bismuth finished and refinished tin (SAC/tin lead) SMT packages under temperature cycling test. [D] . Wang, Weiqiang. 2009

机译：在温度循环测试下，锡和锡铋成品和成品锡（SAC /锡铅）SMT封装的焊点可靠性。
6. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [O] . Mohd Nizam Ab. Rahman, Noor Suhana Mohd Zubir, Raden Achmad Chairdino Leuveano, 2014

机译：锡膏合金的可靠性研究以改善表面安装细间距元件的焊点
7. Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability [O] . Seung-min Chung, Young-ho Kim 2006

机译：使用焊料凸点的细间距和低温粘接及焊点可靠性评估
8. Thermal Cycling Fatigue in DIPs Mounted with Eutectic Tin-Lead Solder Joints in Stub and Gullwing Geometries [R] . Winslow, J. W., Silveira, C. de 1993

机译：DIps中的热循环疲劳，在stub和Gullwing几何中安装有共晶锡铅焊点

Effect of Geometry and Temperature Cycle on the Reliability of WLCSP Solder Joints

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