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Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate

机译：sn浓度对Cu基底高pb焊接反应中大块剥落的影响

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M. H. Tsai; A Y. W. Lin; H. Y. Chuang; C. R. Kaob;
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年度 2009
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1. Effect of Sn concentration on massive spelling in high-Pb soldering reaction with Cu substrate [J] . M.H. Tsai, Y.W. Lin, H.Y. Chuang, Journal of Materials Research . 2009,第11期

机译：锡浓度对铜基高铅钎焊反应中大量拼写的影响
2. Sn concentration on the reactive wetting of high-Pb solder on Cu substrate [J] . Hongqin Wang, Xin Ma, Feng Gao, Materials Chemistry and Physics . 2006,第2a3期

机译：铜衬底上高铅焊料反应性润湿中的锡浓度
3. Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction [J] . Kotadia H. R., Panneerselvam A., Mokhtari O., Journal of Applied Physics . 2012,第7期

机译：液相反应过程中焊料与Cu衬底之间的界面处Cu-Zn和Cu-Al金属间化合物大量剥落
4. Interfacial Reactions of Pure Sn, Sn-3.0Ag-0.5Cu and Sn-9.0Zn Lead-free Solders with the Fe-42Ni Substrate [C] . Yu-Ping Hsieh, Chien-Chung Jao, Yee-Wen Yen The Minerals, Metals Materials Society Annual Meeting Exhibition . 2010

机译：用Fe-42Ni衬底的纯Sn，Sn-3.0Ag-0.5Cu和Sn-9.0Zn无铅焊料的界面反应
5. Mechanisms of Deformation of Lead-Free Sn-Ag-Cu Solder Joints in Cycling [D] . Alghoul, Thaer M. 2019

机译：无铅锡-银-铜焊点在循环中的变形机理
6. Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate [O] . Junhyuk Son, Dong-Yurl Yu, Yun-Chan Kim, 2021

机译：多重回流对Sn-0.5Cu-Al（Si）焊料和Cu基质的界面反应和力学性能的影响
7. Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction [O] . Kotadia H. R., Panneerselvam A., Mokhtari O., 2012

机译：液相反应过程中焊料与Cu衬底之间的界面处Cu-Zn和Cu-Al金属间化合物大量剥落

Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate

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