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Temperature Dependence of Dominant Hillock Phases during Electromigration of Eutectic SnPb Solder Lines

机译：共晶snpb焊料线电迁移过程中优势Hillock相的温度依赖性

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Min-seung Yoon; Oh-han Kim; Young-chang Joo; Young-bae Park;
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年度 2015
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1. Temperature Dependence of Dominant Hillock Phases during Electromigration of Eutectic SnPb Soider Lines [J] . Min-Seung Yoon, Oh-Han Kim, Young-Chang Joo, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2007,第1期

机译：共晶SnPb Soider线电迁移过程中主要小丘相的温度依赖性
2. In-Situ Observation of Electromigration in Eutectic SnPb Solder Lines: Atomic Migration and Hillock Formation [J] . MIN-SEUNG YOON, MIN-KU KO, OH-HAN KIM, Journal of Electronic Materials . 2007,第5期

机译：共晶SnPb焊锡线中电迁移的原位观察：原子迁移和小丘形成
3. In-Situ Observation of Electromigration in Eutectic SnPb Solder Lines: Atomic Migration and Hillock Formation [J] . Min-Seung Yoon, Min-Ku Ko, Oh-Han Kim, Journal of Electronic Materials . 2007,第5期

机译：共晶SnPb焊锡线中电迁移的原位观察：原子迁移和小丘形成
4. Temperature Dependence of Dominant Hillock Phases during Electromigration of Eutectic SnPb Solder Lines [C] . Min-Seung Yoon, Oh-Han Kim, Young-Chang Joo, IUMRS International Conference in Asia . 2007

机译：在共晶SNPB焊点电迁移过程中占主导地位阶段的温度依赖性
5. Effect of coarsened microstructure on electromigration behavior of eutectic lead-tin solder joints [D] . Lee, Yi-Chih 2010

机译：粗化微观结构对共晶铅锡焊点电迁移行为的影响
6. Preparation and Thermal Performance Enhancement of Low Temperature Eutectic Composite Phase Change Materials Based on Na2SO4·10H2O [O] . Pumin Hou, Jinfeng Mao, Fei Chen, 2018

机译：Na2SO4·10H2O基低温共晶复合相变材料的制备及热性能增强
7. Line Length Effect on Electromigration Characteristics of Eutectic SnPb Solder [O] . Yong-Duk Lee, Jang-Hee Lee, Min-Seung Yoon, 2007

机译：对共晶SNPB焊料电迁移特性的线宽效应

Temperature Dependence of Dominant Hillock Phases during Electromigration of Eutectic SnPb Solder Lines

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