首页> 外文OA文献 >Finite Element Modeling of Misalignment in Interconnect Vias

【2h】

Finite Element Modeling of Misalignment in Interconnect Vias

机译：互连孔中不对中的有限元建模

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Anthony S. Holl; Geoffrey K. Reeves; Glenn I. Matthews; Patrick W. Leech;
展开▼
作者单位

展开▼
年度 2015
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Applying x-ray microscopy and finite element modeling to identify the mechanism of stress-assisted void growth in through-silicon vias [J] . L. W. Kong, J. R. Lloyd, K. B Yeap, Journal of Applied Physics . 2011,第V110N5期

机译：应用X射线显微镜和有限元建模确定硅通孔中应力辅助空洞生长的机制
2. Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models [J] . Jamil A. Wakil, Patrick W. Dehaven, Nancy R. Klymko, Journal of Electronic Packaging . 2011,第3期

机译：硅热通孔在局部热瞬态下的热力学响应，采用实验验证的有限元模型
3. Finite element modelling, analysis and identification using novel trial misalignment approach in an unbalanced and misaligned flexible rotor system levitated by active magnetic bearings [J] . Prabhat Kumar, Rajiv Tiwari Mechanical systems and signal processing . 2021,第May期

机译：有限元建模，分析和识别在无磁轴承悬浮的不平衡和未对准的柔性转子系统中使用新型试验错位方法
4. Finite Element Modeling of Misalignment in Interconnect Vias [C] . Holland A.S., Reeves G.K., Matthews G.I., IEE Colloquium on VSAT's in Europe - the Talking is Over, 1995 . 1995

机译：互连通孔中未对准的有限元建模
5. Finite element modeling of electromigration and stress voiding in microelectronic interconnects. [D] . Fridline, Daniel Robert. 2001

机译：微电子互连中电迁移和应力空隙的有限元建模。
6. Modeling of misalignment effects in microfluidic interconnects for modular bio-analytical chip applications [O] . Sudheer D. Rani, Taehyun Park, Byoung Hee You, -1

机译：用于模块化生物分析芯片应用的微流体互连中的未对准效应建模
7. Finite element modeling of misalignment in interconnect vias [O] . Holland A, Reeves G, Matthews G, 2005

机译：互连通孔中未对准的有限元建模
8. Finite Element Modeling and Analysis of MCM High Density Interconnect Vias [R] . Grosse, I., DiTomasso, J. 1996

机译：mCm高密度互连通孔的有限元建模与分析

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

客服微信
服务号