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Analysis of multi-layered microelectronic packaging under uniformly distributed loading

机译：均布荷载下多层微电子封装的分析

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Yujun Wen; Cemal Basaran;
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年度 2003
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1. Analysis of multi-layered microelectronic packaging under uniformly distributed loading [J] . Wen YJ., Basaran C. International Journal of Solids and Structures . 2003,第13a14期

机译：均匀分布载荷下的多层微电子包装分析
2. An analytical model for thermal stress analysis of multi-layered microelectronic packaging [J] . Yujun Wen, Cemal Basaran Mechanics of materials . 2004,第4期

机译：多层微电子封装热应力分析的解析模型
3. Structural response of monolithic and multi-layered circular metallic plates under repeated uniformly distributed impulsive loading: An experimental study [J] . Ziya-Shamami Mojtaba, Babaei Hashem, Mostofi Tohid Mirzababaie, Thin-Walled Structures . 2020,第Pta1期

机译：重复均匀分布脉冲载荷下整体和多层圆形金属板的结构响应：实验研究
4. An analytical model for thermal stress analysis of multi-layered microelectronics packaging [C] . Yujun Wen, Basaran C. . 2004

机译：多层微电子封装热应力分析的分析模型
5. Damage mechanics of microelectronic packaging under combined dynamic and thermal loading. [D] . Chandaroy, Rumpa. 1998

机译：在动态和热载荷作用下微电子包装的损伤机理。
6. Comparative Reliability Studies and Analysis of Au Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging [O] . Gan Chong Leong, Hashim Uda -1

机译：微电子封装中AuPd包覆的Cu和Pd掺杂的Cu线的比较可靠性研究和分析
7. Finite Element Dynamic Analysis Of Non-Uniform Beams On Variable One-Parameter Foundation Subjected To Uniformly Distributed Moving Loads [O] . I.O. Abiala, J.A. Gbadeyan 2015

机译：有限元动态分析在经过均匀分布的移动载荷的可变单参数基础上的非均匀光束
8. Analysis of Stresses and Force Resultants in Oblong Conduits under Uniformly Distributed Loads [R] . Sandhu, R. S., Chen, C. 1988

机译：均布荷载下长圆形管道的应力和受力分析

Analysis of multi-layered microelectronic packaging under uniformly distributed loading

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