首页> 外文OA文献 >Fabricating capacitive micromachined ultrasonic transducers with waferbonding technology

【2h】

Fabricating capacitive micromachined ultrasonic transducers with waferbonding technology

机译：利用晶圆键合技术制造电容式微机械超声换能器

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Yongli Huang; Edward O. Hæggström; Xuefeng Zhuang; Arif S. Ergun; Butrus T. Khuri-yakub;
展开▼
作者单位

展开▼
年度 2015
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Fabricating capacitive micromachined ultrasonic transducers with wafer-bonding technology [J] . Yongli Huang, Ergun A.S., Haeggstrom E., Journal of Microelectromechanical Systems . 2003,第2期

机译：利用晶圆键合技术制造电容式微加工超声换能器
2. A three-mask process for fabricating vacuum-sealed capacitive micromachined ultrasonic transducers using anodic bonding [J] . Yamaner F. Yalc??n, Zhang Xiao, Oralkan ??mer IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control . 2015,第5期

机译：使用阳极键合制造真空密封电容式微加工超声换能器的三掩模工艺
3. A 1-D Capacitive Micromachined Ultrasonic Transducer Imaging Array Fabricated With a Silicon-Nitride-Based Fusion Process [J] . Logan A., Wong L. L. P., Yeow J. T. W. Mechatronics, IEEE/ASME Transactions on . 2011,第5期

机译：基于氮化硅的融合工艺制造的一维电容式微机械超声换能器成像阵列
4. Fabricating capacitive micromachined ultrasonic transducers with direct wafer-bonding and LOCOS technology [C] . Park K. K., Lee H. J., Kupnik M., IEEE International Conference on Micro Electro Mechanical Systems . 2008

机译：用直接晶圆粘合和LocOS技术制造电容式微机械超声换能器
5. Capacitive micromachined ultrasonic transducers (CMUTs) built with wafer-bonding technology. [D] . Huang, Yongli. 2005

机译：采用晶片键合技术构建的电容式微加工超声换能器（CMUT）。
6. Encapsulation of Capacitive Micromachined Ultrasonic Transducers (CMUTs) for the Acoustic Communication between Medical Implants [O] . Jorge Oevermann, Peter Weber, Steffen H. Tretbar 2021

机译：用于医疗植入物之间的声学通信的电容微机械超声换能器（CMUT）的封装
7. Residual Stress in Capacitive Micromachined Ultrasonic Transducers Fabricated with Anodic Bonding Using SOI Wafer [O] . Walter V., Bourbon G., Le Moal P. 2014

机译：使用SOI晶片阳极键合制造的电容式微机械超声换能器中的残余应力
8. DC-GHz Micromachined Capacitive Air Transducers [R] . Khuri-Yakub, B. T., Degertekin, F. L., Ergun, A. S. 1999

机译：DC-GHz微机械电容式空气传感器

Fabricating capacitive micromachined ultrasonic transducers with waferbonding technology

著录项

引文网络

相似文献

相关主题

期刊订阅