首页> 外文OA文献 >Micro-Impact Test on Lead-Free BGA Balls on Au/Electrolytic Ni/Cu Bond Pad

【2h】

Micro-Impact Test on Lead-Free BGA Balls on Au/Electrolytic Ni/Cu Bond Pad

机译：au /电解Ni / Cu键合焊盘上无铅BGa球的微冲击试验

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Shengquan Ou; Yuhuan Xu; K. N. Tu; M. O. Alam; Y. C. Chan;
展开▼
作者单位

展开▼
年度 2014
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au/Ni Coated Cu Pads [J] . Keisuke Uenishi, Toshio Saeki, Yasuhiro Kohara Materials transactions . 2001,第5期

机译：无铅焊锡球中的铜对带有金/镍涂层铜垫的BGA接头组织的影响
2. Reliability of BGA Solder Joints on the Au/Ni/Cu Bond Pad-Effect of Thicknesses of Au and Ni Layer [J] . Alam M.O., Wu B.Y., Chan Y.C., IEEE transactions on device and materials reliability . 2006,第期

机译：BGA焊点对Au / Ni / Cu焊盘的可靠性-Au和Ni层厚度的影响
3. Electromigration in eutectic In-48Sn ball grid array (BGA) solder interconnections with Au/Ni/Cu pads [J] . Yi Li, Fengshun Wu, Y. C. Chan Journal of materials science . 2015,第11期

机译：具有Au / Ni / Cu焊盘的共晶In-48Sn球栅阵列（BGA）焊料互连中的电迁移
4. Micro-Impact Test on Lead-Free BGA Balls on Au/Electrolytic Ni/Cu Bond Pad [C] . Shengquan Ou, Yuhuan Xu, K. N. Tu Electronic Components and Technology Conference . 2005

机译：AU /电解Ni / Cu键合垫上无铅BGA球的微冲击试验
5. Liquid-Phase Diffusion Bonding and the Development of a Cu-Ni/Sn Composite Solder Paste for High Temperature Lead-Free Electrical Connections [D] . Choquette, Stephanie Michele. 2018

机译：液相扩散键合和用于高温无铅电气连接的Cu-Ni / Sn复合焊膏的开发
6. Effects of Bonding Parameters on Free Air Ball Properties and Bonded Strength of Ag-10Au-3.6Pd Alloy Bonding Wire [O] . Jun Cao, Junchao Zhang, John Persic, 2020

机译：粘合参数对Ag-10au-3.6PD合金键合线自由空气性能和粘结强度的影响
7. Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au/Ni Coated Cu Pads [O] . Keisuke Uenishi, Toshio Saeki, Yasuhiro Kohara, 2001

机译：Pb自由焊球中Cu在BGA关节与Au / Ni涂层Cu垫的微观结构的影响

Micro-Impact Test on Lead-Free BGA Balls on Au/Electrolytic Ni/Cu Bond Pad

著录项

引文网络

相似文献

相关主题

期刊订阅