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Hermetic Integration of Liquids in MEMS by Room Temperature, High-Speed Plugging of Liquid-Filled Cavities at Wafer Level

机译：室温下液体在mEms中的密封集成，晶圆级液体填充腔的高速堵塞

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M. Antelius; A. C. Fischer; F. Niklaus; G. Stemme; N. Roxhed;
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年度 2011
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1. Hermetic integration of liquids using high-speed stud bump bonding for cavity sealing at the wafer level [J] . Mikael Antelius, Andreas C. Fischer, Frank Niklaus, Journal of Micromechanics and Microengineering . 2012,第4期

机译：使用高速柱头凸点键合技术对液体进行气密密封，以在晶圆级进行腔体密封
2. Wafer-level MEMS packaging: HERMETICITY AND CAVITY AMBIENT CONTROL [J] . ELS PARTON, HARRIE TILMANS Advanced Packaging . 2002,第4期

机译：晶圆级MEMS封装：热度和腔环境控制
3. Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging [J] . Al Farisi Muhammad Salman, Hirano Hideki, Tanaka Shuji Sensors and Actuators, A. Physical . 2018,第期

机译：低温密封热压缩粘合，采用电镀铜密封框架通过飞行切割用于晶圆级MEMS包装
4. Hermetic integration of liquids in MEMS by room temperature, high-speed plugging of liquid-filled cavities at wafer level [C] . Antelius M., Fischer A.C., Niklaus F., 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems . 2011

机译：室温下液体在MEMS中的气密集成，晶圆级液体填充腔的高速堵塞
5. Low temperature hermetically sealed three-dimensional MEMS device for wireless optical communication [D] . Agarwal, Rahul 2007

机译：用于无线光通信的低温密封三维MEMS器件
6. Ultrasensitive Mach-Zehnder Interferometric Temperature Sensor Based on Liquid-Filled D-Shaped Fiber Cavity [O] . Hui Zhang, Shecheng Gao, Yunhan Luo, 2018

机译：基于液体填充D形光纤腔的超灵敏Mach-Zehnder干涉温度传感器
7. Hermetic integration of liquids in MEMS by room temperature, high-speed plugging of liquid-filled cavities at wafer level [O] . Antelius, Mikael, Fischer, Andreas, Niklaus, Frank, 2011

机译：室温下液体在MEMS中的气密集成，晶圆级液体填充腔的高速堵塞

Hermetic Integration of Liquids in MEMS by Room Temperature, High-Speed Plugging of Liquid-Filled Cavities at Wafer Level

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