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Photoresist stripping by ozone/water processes: Effect of additives

机译：通过臭氧/水处理的光刻胶剥离：添加剂的影响

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H. Vankerckhoven; F. De Smedt; M. Claes; S. De; M. M. Heyns; C. Vinckier;
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1. Photoresist stripping by ozone/water processes: Effect of additives [J] . H Vankerckhoven, F. De Smedt, K. Vandersmissen, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2005,第0期

机译：臭氧/水工艺进行的光刻胶剥离：添加剂的影响
2. Effect of Additives on the Removal Efficiency of Photoresist by Ozone/DI-Water Processes: Experimental Study [J] . H. Vankerckhoven, F. De Smedt, M. Claes, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2003,第0期

机译：添加剂对臭氧/去离子水工艺光致抗蚀剂去除效率的影响：实验研究
3. Novel photoresist stripping technology using ozone/vaporized water mixture [J] . Abe H., Iwamoto H., Toshima T., IEEE Transactions on Semiconductor Manufacturing . 2003,第3期

机译：使用臭氧/蒸发水混合物的新型光刻胶剥离技术
4. Photoresist stripping by ozone/water processes: Effect of additives [C] . H. Vankerckhoven, F. De Smedt, K. Vandersmissen, International Symposium on Ultra Clean Processing of Silicon Surfaces . 2005

机译：通过臭氧/水过程剥离光致抗蚀剂：添加剂的作用
5. Rational design of non-damaging capacitively coupled plasma etching and photoresist stripping processes for ultralow k dielectric materials. [D] . Kuo, Ming-Shu. 2010

机译：合理设计超低k介电材料的无损电容耦合等离子体蚀刻和光刻胶剥离工艺。
6. Ozone-Based Advanced Oxidation Processes for Primidone Removal in Water using Simulated Solar Radiation and TiO2 or WO3 as Photocatalyst [O] . Manuel A. Figueredo, Eva M. Rodríguez, Manuel Checa, 2019

机译：使用模拟的太阳辐射和TiO2或WO3作为光催化剂的基于臭氧的高级氧化工艺去除水中的吡啶甲酮
7. CFD Analysis of Flow Structure between Rotating Disks for Semiconductor Photoresist Stripping Using High Concentrated Ozone Water [O] . Masato KOBAYASHI, Yutaka ABE 2013

机译：高浓臭氧水旋转盘之间的流动结构的CFD分析
8. Comparison of chilled DI water/ozone and CO(sub 2)-based supercritical fluids as replacements for photoresist-stripping solvents [R] . Rubin, J. B. , Davenhall, L. B. , Barton, J. , 1998

机译：冷却DI水/臭氧和CO（sub 2）基超临界流体作为光刻胶剥离溶剂替代品的比较

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