首页> 外文OA文献 >3D-NoC: Reconfigurable 3D Photonic On-Chip Interconnect for Multicores

【2h】

3D-NoC: Reconfigurable 3D Photonic On-Chip Interconnect for Multicores

机译：3D-NoC：用于多核的可重配置3D光子片上互连

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Y Morris; Avinash Karanth Kodi; Ahmed Louri;
展开▼
作者单位

展开▼
年度 2014
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. On-chip wireless silicon photonics: from reconfigurable interconnects to lab-on-chip devices [J] . Carlos García-Meca, Sergio Lechago, Antoine Brimont, Light: Science & Applications . 2017,第9期

机译：片上无线硅光子学：从可重新配置的互连到片上实验室设备
2. Guest Editors'' Introduction: On-Chip Interconnects for Multicores [J] . Kundu Partha, Peh Li-Shiuan IEEE Micro . 2007,第5期

机译：客座编辑''简介：多核片上互连
3. Integrated reconfigurable microring based silicon WDM receiver for on-chip optical interconnect [J] . Shen Ao, Qiu Chen, Yang Long-Zhi, Journal of optics . 2015,第5期

机译：基于集成的可重新配置的基于微型硅WDM接收器，用于片上光学互连
4. 3D-NoC: Reconfigurable 3D photonic on-chip interconnect for multicores [C] . Morris Randy, Kodi Avinash Karanth, Louri Ahmed 2012 IEEE 30th International Conference on Computer Design. . 2012

机译：3D-NoC：用于多核的可重新配置3D光子片上互连
5. Interconnect Design Techniques for Multicore and 3D Integrated Circuits. [D] . Zhou, Pingqiang. 2012

机译：多核和3D集成电路的互连设计技术。
6. On-chip wireless silicon photonics: from reconfigurable interconnects to lab-on-chip devices [O] . Carlos García-Meca, Sergio Lechago, Antoine Brimont, 2017

机译：片上无线硅光子学：从可重新配置的互连到片上实验室设备
7. On-chip wireless silicon photonics: from reconfigurable interconnects to lab-on-chip devices [O] . Carlos García-Meca, Sergio Lechago, Antoine Brimont, 2017

机译：片上无线硅光子：从可重新配置到芯片设备的可重新配置互连

3D-NoC: Reconfigurable 3D Photonic On-Chip Interconnect for Multicores

著录项

引文网络

相似文献

相关主题

期刊订阅