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Effect of Isothermal Aging on Intermetallic Compounds and Kirkendall Void Growth Kinetics of Au Stud Bumps

机译：等温时效对金钉凸块金属间化合物和柯肯达尔空隙生长动力学的影响

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Gi-tae Lim; Byoung-joon Kim; Kiwook Lee; Jaedong Kim; Young-chang Joo; Young-bae Park;
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年度 2015
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1. Effect of isothermal aging on intermetallic compounds and Kirkendall void growth kinetics of Au stud bumps [J] . Gi-Tae Lim, Byoung-Joon Kim, Kiwook Lee, Metals and Materials International . 2009,第5期

机译：等温时效对Au柱形凸点金属间化合物和Kirkendall空洞生长动力学的影响
2. Effect of Isothermal Aging on Intermetallic Compounds and Kirkendall Void Growth Kinetics of Au Stud Bumps [J] . Gi-Tae Lim, Byoung-Joon Kim, Kiwook Lee Metals and Materials International . 2009,第5期

机译：等温时效对Au螺柱凸点金属间化合物和Kirkendall空隙生长动力学的影响
3. Effect of Au, Pd and Pt addition in Cu on the growth of intermetallic compounds and the Kirkendall voids in the Cu-Sn system [J] . Varun A. Baheti, Praveen Kumar, Aloke Paul Journal of materials science . 2017,第22期

机译：Cu中Au，Pd和Pt的添加对Cu-Sn系统中金属间化合物和Kirkendall空洞生长的影响
4. Intermetallic compound and Kirkendall void growth in Cu pillar bump during annealing and current stressing [C] . Byoung-Joon Kim, Gi-Tae Lim, Jaedong Kim, Electronic Components and Technology Conference . 2008

机译：在退火和电流应力期间Cu柱凸块的金属间化合物和Kirkendall void生长
5. Electromigration enhanced kinetics of copper-tin intermetallic compounds in lead-free solder joints and copper low-k dual damascene processing using step and flash imprint lithography. [D] . Chao, Huang-Lin. 2009

机译：电迁移增强了无铅焊点中铜-锡金属间化合物的动力学，并使用分步和闪光压印光刻技术进行了铜低k双大马士革工艺。
6. Growth kinetics of Cu6Sn5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current [O] . Jiayun Feng, Chunjin Hang, Yanhong Tian, -1

机译：电流增强Cu-Sn5界面反应中Cu6Sn5金属间化合物的生长动力学
7. Condensation and growth of Kirkendall voids in intermetallic compounds [O] . Weinberg, Kerstin, Boehme, Thomas 2008

机译：柯肯德尔空隙在金属间化合物中的凝结和生长
8. Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging [R] . Minor, A. M. , Morris, J. W. 1999

机译：老化后在焊料 - 基板界面上生长au-Ni-sn金属间化合物

Effect of Isothermal Aging on Intermetallic Compounds and Kirkendall Void Growth Kinetics of Au Stud Bumps

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