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A Study on Water- Mark Defects in Copper / Low-k Chemical Mechanical Polishing

机译：铜/低k化学机械抛光中水痕缺陷的研究

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Ja-hyung Han; Ja-eung Koo; Kyo-se Choi; Byung-lyul Park; Sang-rok Hah; Sun-yong Lee; Young-jae Kang; Jin-goo Park;
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1. A Study on Water- Mark Defects in Copper/ Low-k Chemical Mechanical Polishing [J] . Ja-Hvunq Han, Ja-Eung Koo, Kyo-Se Choi, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2008,第0期

机译：铜/低k化学机械抛光中水印缺陷的研究
2. A Study on Water- Mark Defects in Copper/ Low-k Chemical MechanicalPolishing [J] . Ja-Hvunci Han, Ja-EungKoo, Kyo-Se Choi, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2008,第Null期

机译：铜/低k化学机械抛光中水印缺陷的研究
3. A Study on Water- Mark Defects in Copper/ Low-k Chemical MechanicalPolishing [J] . Ja-Hvunci Han, Ja-EungKoo, Kyo-Se Choi, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2008,第Null期

机译：铜/低k化学机械抛光中水印缺陷的研究
4. A Study on Water- Mark Defects in Copper/Low-k Chemical Mechanical Polishing [C] . Ja-Hvunq Han, Ja-Eung Koo, Kyo-Se Choi, International Symposium on Ultra Clean Processing of Silicon Surfaces . 2008

机译：铜/低钾化学机械抛光中的水标缺陷研究
5. Light scatter from defects on chemically-mechanically polished wafers. [D] . Ding, Ping. 2000

机译：光从化学机械抛光的晶片上的缺陷散射。
6. Effects of femoral bone defect morphology on initial polished tapered stem stability in massive defect model: a biomechanical study [O] . Tohru Irie, Daisuke Takahashi, Tsuyoshi Asano, 2019

机译：股骨缺损形态对大缺损模型初始抛光锥形茎稳定性的影响：生物力学研究
7. Synergy between chemical dissolution and mechanical abrasion during chemical mechanical polishing of copper [O] . Che, Wei 2005

机译：铜化学机械抛光过程中化学溶解与机械磨损之间的协同作用

A Study on Water- Mark Defects in Copper / Low-k Chemical Mechanical Polishing

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