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Correlation between jamming and skipping during solder paste printing

机译：焊膏印刷过程中卡纸与跳线的相关性

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S. R. Hillman; S. H. Mannan; R. Durairaj; A. Seman; N. N. Ekere; M. Dusek; C. Hunt;
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年度 2015
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1. Correlation between jamming and skipping during solder paste printing [J] . S. R. Hillman, S. H. Mannan, R. Durairaj, Soldering & Surface Mount Technology . 2005,第4期

机译：锡膏印刷过程中卡纸和跳纸之间的关系
2. Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance [J] . S. Mallik, M. Schmidt, R. Bauer, Soldering & Surface Mount Technology . 2010,第4期

机译：通过流变测试方法评估焊膏行为及其与印刷性能的关系
3. Correlation of solder paste rheology with computational simulations of the stencil printing process [J] . R. Durairaj, G. J. Jackson, N. N. Ekere, Soldering & Surface Mount Technology . 2002,第1期

机译：锡膏流变性与模板印刷过程的计算模拟的相关性
4. Study of the rheological behaviours of Sn-Ag-Cu solder pastes and their correlation with printing performance [C] . Mallik S., Thieme J., Bauer R., Electronics Packaging Technology Conference, 2009. EPTC '09 . 2009

机译：Sn-Ag-Cu锡膏的流变行为及其与印刷性能的关系研究
5. Stencil Printing Optimization to Control Solder Paste Volume Transfer Efficiency [D] . Khader, Nourma. 2018

机译：模板印刷优化控制焊膏体积传递效率
6. Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components [O] . Marina Makrygianni, Filimon Zacharatos, Kostas Andritsos, 2021

机译：通过激光引导的超细俯仰电子元件组装的激光诱导的前进转印的环保无铅焊膏印刷
7. Characterisation of lead-free solder pastes and their correlation with the stencil printing process performance [O] . Marks Antony Edward, Henkel 2012

机译：无铅焊膏的特性及其与模板印刷工艺性能的关系

Correlation between jamming and skipping during solder paste printing

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