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The use of metal filled via holes for improving isolation in LTCC RF and wireless multichip packages

机译：使用金属填充通孔来改善LTCC RF和无线多芯片封装中的隔离

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George E. Ponchak; Senior Member; Donghoon Chun; Jong-gwan Yook; Linda P. B. Katehi;
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1. The use of metal filled via holes for improving isolation in LTCCRF and wireless multichip packages [J] . Ponchak G.E., Donghoon Chun, Jong-Gwan Yook, IEEE Transactions on Advanced Packaging . 2000,第1期

机译：使用金属填充通孔来改善LTCC RF和无线多芯片封装中的隔离
2. The use of metal filled via holes for improving isolation in LTCC RF and wireless multichip packages [J] . Ponchak G.E., Donghoon Chun IEEE Transactions on Advanced Packaging . 2000,第1期

机译：使用填充金属的通孔来改善LTCC RF和无线多芯片封装中的隔离
3. High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications [J] . Decrossas Emmanuel, Glover Michael D., Porter Kaoru, Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2015,第3期

机译：适用于多芯片模块和系统级封装应用的高性能和高数据速率准同轴LTCC垂直互连过渡
4. Filled Via Hole Fences For Crosstalk Control of Microstrip Lines in LTCC Packages [C] . George E. Ponchak, Donghoon Chen, Jong-Gwan Yook, International Conference on Advanced Packaging and Systems . 2002

机译：填充通孔栅栏，用于LTCC封装中的微带线串扰控制
5. Architecting a One-to-Many Traffic-Aware and Secure Millimeter-Wave Wireless Network-in-Package Interconnect for Multichip Systems [D] . Ahmed, M. Meraj. 2021

机译：架构一对多交通感知和安全的毫米波无线网络连接互连，用于多芯片系统
6. Fabrications and Performance of Wireless LC Pressure Sensors through LTCC Technology [O] . Lin Lin, Mingsheng Ma, Faqiang Zhang, 2018

机译：通过LTCC技术的无线LC压力传感器的制造和性能
7. The Use of Metal Filled Via Holes for Improving Isolation in LTCC RF and Wireless Multichip Packages [O] . Chun Donghoon, Yook Jong-Gwan, Katehi Linda P. B., 1999

机译：使用金属填充通孔改善LTCC RF和无线多芯片封装中的隔离度
8. The Use of Metal Filled Via Holes for Improving Isolation in LTCC RF and Wireless Multichip Packages [R] . Ponchak, George E., Chun, Donghoon, Yook, Jong-Gwan, 1999

机译：使用金属填充通孔改善LTCC RF和无线多芯片封装中的隔离

The use of metal filled via holes for improving isolation in LTCC RF and wireless multichip packages

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