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Compact Modeling and Analysis of Through-Si-Via-Induced Electrical Noise Coupling in Three-Dimensional ICs

机译：三维集成电路中穿硅通孔感应电噪声耦合的紧凑建模与分析

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Chuan Xu; Student Member; Roberto Suaya; Senior Member; Kaustav Banerjee;
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1. Compact Modeling and Analysis of Through-Si-Via-Induced Electrical Noise Coupling in Three-Dimensional ICs [J] . Xu C., Suaya R., Banerjee K. Electron Devices, IEEE Transactions on . 2011,第11期

机译：三维集成电路中通过硅通孔引起的电噪声耦合的紧凑建模和分析
2. Some Clarifications on “Compact Modeling and Analysis of Through-Si-Via Induced Electrical Noise Coupling in Three-Dimensional ICs” [J] . Xu C., Suaya R., Banerjee K. Electron Devices, IEEE Transactions on . 2012,第10期

机译：对“三维IC中通过Si-Via感应的电噪声耦合的紧凑建模和分析”的一些澄清
3. The Analysis and Optimization Design of Thermal-Electrical Coupling System with Consideration of Numerical Noises [J] . Zhang Zhuo, Yu Fei, Xu Bo, Journal of computational and theoretical nanoscience . 2016,第10期

机译：考虑数字噪声热电耦合系统的分析与优化设计
4. Compact modeling and analysis of coupling noise induced by through-Si-vias in 3-D ICs [C] . 2010 IEEE International Electron Devices Meeting . 2010

机译：在3D IC中通过硅通孔引起的耦合噪声的紧凑建模和分析
5. Synthesized compact models for substrate noise coupling in mixed-signal ICs. [D] . Lan, Hai. 2006

机译：用于混合信号IC中基板噪声耦合的紧凑型综合模型。
6. Effects of different three-dimensional electrodes on epiretinal electrical stimulation by modeling analysis [O] . Xun Cao, Xiaohong Sui, Qing Lyu, 2015

机译：通过建模分析不同三维电极对视网膜电刺激的影响
7. Compact Substrate Models For Efficient Noise Coupling and Signal Isolation Analysis [O] . Renatas Jakushokas, Emre Salman, Eby G. Friedman, 2013

机译：紧凑的基板模型，可实现高效的噪声耦合和信号隔离分析

Compact Modeling and Analysis of Through-Si-Via-Induced Electrical Noise Coupling in Three-Dimensional ICs

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