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The simulation and analysis of current crowding and Joule heat in flip chip solder bumps

机译：倒装焊片凸点电流拥挤和焦耳热的模拟分析

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Peisheng Liu; Longlong Yang; Jinxin Hang; Ying Lu;
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1. Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints [J] . Y. C. Liang, W. A. Tsao, Chin Chen, Journal of Applied Physics . 2012,第4期

机译：铜柱凸点下金属化对倒装焊点电迁移的电流拥挤和焦耳热效应的影响
2. Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration [J] . S. W. Liang, Y. W. Chang, Chih Chen Applied Physics Letters . 2006,第17期

机译：痕量Al对加速电迁移下倒装芯片焊点焦耳热和电流拥挤的影响
3. Effect of current crowding and Joule heating on electromigration-induced failure in flip chip composite solder joints tested at room temperature [J] . J. W. Nah, J. O. Suh, K. N. Tu Journal of Applied Physics . 2005,第1期

机译：电流拥挤和焦耳热对室温下测试的倒装芯片复合焊点中电迁移引起的失效的影响
4. The simulation and analysis of current crowding and Joule heat in flip chip solder bumps [C] . Peisheng Liu, Longlong Yang, Jinxin Hang Annual Conference of the Chinese Society of Micro-Nano Technology . 2015

机译：倒装芯片焊料凸块当前拥挤和焦耳热的仿真与分析
5. Investigation of electromigration behavior in lead-free flip chip solder bumps. [D] . Kalkundri, Kaustubh Jayant. 2010

机译：研究无铅倒装芯片焊料凸块中的电迁移行为。
6. Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer [O] . Lei Su, Tielin Shi, Zhensong Xu, 2013

机译：使用超声波传感器检查倒装芯片焊锡凸点的缺陷
7. Effect of Joule Heating on Electromigration Characteristics of Sn-3.5Ag Flip Chip Solder Bump [O] . Jang-Hee Lee, Seung-Taek Yang, Min-Suk Suh, 2007

机译：焦耳加热对SN-3.5AG倒装芯片焊料凸块电迁移特性的影响

The simulation and analysis of current crowding and Joule heat in flip chip solder bumps

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