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Comparative Evaluation of Thermal Interface Materials for Improving the Thermal Contact between an Operating Computer Microprocessor and Its Heat Sink

机译：用于改善操作计算机微处理器与其散热器之间热接触的热界面材料的比较评估

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Timothy A. Howe; Chia-ken Leong; D. D. L. Chung;
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年度 2014
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1. Comparative Evaluation of Thermal Interface Materials for Improving the Thermal Contact between an Operating Computer Microprocessor and Its Heat Sink [J] . TIMOTHY A.HOWE, CHIA-KEN LEONG, D.D.L.CHUNG Journal of Electronic Materials . 2006,第8期

机译：热界面材料的比较评估，以改善计算机微处理器与散热器之间的热接触
2. Comparative evaluation of thermal interface materials for improving the thermal contact between an operating computer microprocessor and its heat sink [J] . Timothy A. Howe, Chia-Ken Leong, D. D. L. Chung Journal of Electronic Materials . 2006,第8期

机译：热界面材料的比较评估，以改善运行中的计算机微处理器与其散热器之间的热接触
3. A Hertzian contact based model to estimate thermal resistance of thermal interface material for high-performance microprocessors [J] . Shia D., Yang J. Microelectronics Journal . 2021,第Juna期

机译：基于Hertzian接触的模型，以估算高性能微处理器热界面材料的热阻
4. THERMAL MANAGEMENT of IC's and MICROPROCESSOR USING HEAT SINKS (PIN FIN AND CHANNEL) INCORPORATING PHASE CHANGE MATERIALS (PCM) FOR TRANSIENT OPERATION [C] . Maurice J. Marongiu, M.K. Berhe, G.S. Fallon, International symposium on microelectronics . 1999

机译：使用热沉（引脚鳍和通道）结合相变材料（PCM）进行瞬态操作，对IC和微处理器进行热管理
5. Improvement and evaluation of thermal, electrical, sealing and mechanical contacts, and their interface materials. [D] . Luo, Xiangcheng. 2000

机译：改进和评估热，电，密封和机械触点及其界面材料。
6. Graphene-Assisted Thermal Interface Materials with a Satisfied Interface Contact Level Between the Matrix and Fillers [O] . Bo Tang, Xufei Li, Weiqiu Huang, 2018

机译：石墨烯辅助的热界面材料基质与填料之间的界面接触度令人满意
7. Evaluation of Thermal Contact Resistance at the Interface Composed of Dissimilar Materials [O] . 福岡俊道, 野村昌孝, 山田章博 2010

机译：异种材料组成界面的热接触电阻评估

Comparative Evaluation of Thermal Interface Materials for Improving the Thermal Contact between an Operating Computer Microprocessor and Its Heat Sink

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