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Power comparison between high-speed electrical and optical interconnects for interchip communication

机译：用于芯片间通信的高速电气和光学互连之间的功率比较

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Hoyeol Cho; Student Member; Pawan Kapur; Krishna C. Saraswat;
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年度 2004
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专利

1. 3D optical interconnects for high-speed interchip and interboard communications [J] . Louri A., Hongki Sung Computer . 1994,第10期

机译：用于高速芯片间和板间通信的3D光学互连
2. Power Efficiency Comparisons of Interchip Optical Interconnect Architectures [J] . Palaniappan A., Palermo S. Circuits and Systems II: Express Briefs, IEEE Transactions on . 2010,第5期

机译：芯片间光互连架构的功率效率比较
3. Low-power BiCMOS circuits for high-speed interchip communication [J] . Elrabaa M.S., Elmasry M.I. IEEE Journal of Solid-State Circuits . 1997,第4期

机译：用于高速芯片间通信的低功耗BiCMOS电路
4. Power comparison between high-speed electrical and optical interconnects for inter-chip communication [C] . Hoyeol Cho, Pawan Kapur, Saraswat K.C. Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International . 2004

机译：用于芯片间通信的高速电气和光学互连之间的功率比较
5. Speed and energy comparison between electrical and electro-optical interconnects and application to optoelectronic computing. [D] . Yayla, Ibrahim Gokce. 1996

机译：电气和光电互连之间的速度和能量比较以及在光电计算中的应用。
6. A self-assembled microbonded germanium/silicon heterojunction photodiode for 25 Gb/s high-speed optical interconnects [O] . Chih-Kuo Tseng, Wei-Ting Chen, Ku-Hung Chen, -1

机译：自组装的微键合锗/硅异质结光电二极管用于25 Gb / s高速光学互连
7. Power Efficiency Comparisons of Interchip Optical Interconnect Architectures [O] . Samuel Palermo 2015

机译：芯片间光互连结构的功效比较

Power comparison between high-speed electrical and optical interconnects for interchip communication

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