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Polymeric Conductive Pastes as Solder Replacement for Flip-Chip Attachment

机译：聚合物导电浆料作为倒装芯片附件的焊料更换

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Simon S Ang; William D. Brown; Kaoru U. Maner; Simon S. Ang; Senior Member; Leonard W. Schaper;
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1. Polymeric conductive pastes as solder replacement for flip-chip attachment [J] . Maner K.U., Ang S.S. IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging . 1998,第4期

机译：聚合物导电胶可替代倒装芯片的焊料
2. Polymeric conductive pastes as solder replacement for flip-chipattachment [J] . Maner K.U., Ang S.S., Schaper L.W., IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, Advanced Packaging . 1998,第4期

机译：聚合物导电胶可替代倒装芯片的焊料
3. Polymeric conductive pastes as solder replacement for flip-chipattachment [J] . Maner K.U., Ang S.S., Schaper L.W., IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, Advanced Packaging . 1998,第4期

机译：聚合物导电膏可替代倒装芯片的焊料
4. Viscoelastic properties of solder pastes and isotropic conductive adhesives used for flip-chip assembly [C] . Durairaj R., Mallik S., Seman A., IEEE/CPMT International Electronic Manufacturing Technology Symposium;IEMT . 2008

机译：倒装芯片组装中使用的焊膏和各向同性导电胶的粘弹性
5. A novel conductive-polymer-based integration process for high-performance flip-chip packages. [D] . Lohokare, Saurabh. 2004

机译：一种基于导电聚合物的新型集成工艺，用于高性能倒装芯片封装。
6. Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength [O] . Anas M. Atieh, Tala J. Abedalaziz, Abdulaziz AlHazaa, 2019

机译：使用Sn纳米粒子增强焊膏焊接无源部件：对微观结构和关节强度的影响
7. Study of the time-dependent rheological behaviour of lead-free solder pastes and flux mediums used for flip-chip assembly applications [O] . Mallik Sabuj 2009

机译：研究用于倒装芯片组装应用的无铅焊锡膏和助熔剂的时变流变行为
8. Material development of polymer/metal paste for flip-chip attach interconnection technology. Quarterly report [R] . 1997

机译：用于倒装芯片连接互连技术的聚合物/金属浆料的材料开发。季度报告

Polymeric Conductive Pastes as Solder Replacement for Flip-Chip Attachment

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