首页> 外文OA文献 >Electroless Deposited Nickel Hard Mask for High Density Plasma Etching Applications

【2h】

Electroless Deposited Nickel Hard Mask for High Density Plasma Etching Applications

机译：用于高密度等离子体蚀刻应用的化学沉积镍硬掩模

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
A. M. Nunes; S. A. Moshkalev; A. Flacker; P. J. Tatsch; E. Besseler;
展开▼
作者单位

展开▼
年度 2016
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Fabrication of Nickel Plasma Etching Mask by Nano-Imprint Lithography and Electroless Plating [J] . Shingo Shimizu, Hideki Tanabe, Masaaki Yasuda, Journal of Photopolymer Science and Technology . 2020,第5期

机译：纳米压印光刻和化学镀镍镍等离子体蚀刻面罩的制造
2. Patterning NiB electroless deposited on glass using an electroplated Cu mask, microcontact printing, and wet etching [J] . Delamarche E., Geissler M., Magnuson RH., Langmuir: The ACS Journal of Surfaces and Colloids . 2003,第14期

机译：使用电镀铜掩膜，微接触印刷和湿法蚀刻对化学沉积在玻璃上的NiB进行构图
3. Etching characteristics of magnetic materials (Co, Fe, Ni) using CO/NH3 gas plasma for hardening mask etching [J] . Matsui N., Mashimo K., Egami A., Vacuum: Technology Applications & Ion Physics: The International Journal & Abstracting Service for Vacuum Science & Technology . 2002,第3a4期

机译：使用CO / NH3气体等离子体对磁性材料（Co，Fe，Ni）进行刻蚀的特性，以进行掩模刻蚀
4. Electroless Deposited Nickel Hard Mask for High Density Plasma Etching Applications [C] . A.M. Nunes, S. A. Moshkalev, A. Flacker, Microelectronics Technology and Devices-SBMicro 2008 . 2008

机译：用于高密度等离子蚀刻应用的化学沉积镍硬掩模
5. High-density plasma etching of III-nitrides: Process development, device applications and damage remediation. [D] . Singh, Rajwinder. 2003

机译：III型氮化物的高密度等离子体蚀刻：工艺开发，设备应用和损坏修复。
6. Triple-phase boundary and power density enhancement in thin solid oxide fuel cells by controlled etching of the nickel anode [O] . Rabi Ebrahim, Mukhtar Yeleuov, Ainur Issova, 2014

机译：通过对镍阳极的可控刻蚀可在薄固体氧化物燃料电池中提高三相边界和功率密度
7. Phase composition, microstructure and microhardness of electroless nickel composite coating co-deposited with SiC on cast aluminium LM24 alloy substrate [O] . Franco, M., Sha, W., Malinov, S., 2013

机译：铸铝LM24合金基体上与SiC共沉积的化学镀镍复合涂层的相组成，组织和显微硬度
8. High-Density Plasma Etching of Group-III Nitride Films for Device Application [R] . Baca, A. G. , Crawford, M. H. , Han, J. , 1999

机译：用于器件应用的III族氮化物薄膜的高密度等离子体蚀刻

Electroless Deposited Nickel Hard Mask for High Density Plasma Etching Applications

著录项

引文网络

相似文献

相关主题

期刊订阅