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Study on Thin Diamond Wire Slicing with Taguchi method

机译：用Taguchi法研究薄金刚石线切割

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Pei-lum Tso; Bo-huei Yan; Chan Hsing Lo;
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1. Study on diamond wire wear, surface quality, and subsurface damage during multi-wire slicing of c-plane sapphire wafer [J] . Gupta Ajay, Chen Chao-Chang A., Hsu Hsien-Wei The International Journal of Advanced Manufacturing Technology . 2019,第5a8期

机译：C-Plane蓝宝石晶片多线切割过程中的金刚石磨损，表面质量和地下损伤研究
2. Preparation of thin solid electrolyte by hot-pressing and diamond wire slicing [J] . Kotobuki Masashi, Lei Houhua, Chen Yu, RSC Advances . 2019,第21期

机译：通过热压和金刚石线切割制备薄固体电解质
3. Preparation of thin solid electrolyte by hot-pressing and diamond wire slicing [J] . Masashi Kotobuki, Houhua Lei, Yu Chen, RSC Advances . 2019,第21期

机译：热压金刚石丝切片制备稀薄的固体电解质
4. Study on Thin Diamond Wire Slicing with Taguchi method [C] . Pei-Lum Tso, Bo-Huei Yan, Chan Hsing Lo International Conference on Advanced Manufacture; 20051128-1202; Taipei(CT) . 2006

机译：田口法切细金刚石丝的研究
5. Optimization of inversion ankle taping: A taguchi method based study. [D] . Boscolo, Marco Santino. 2013

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6. The kinetics of thin-layer drying and modelling for mango slices and the influence of differing hot-air drying methods on quality [O] . Khuthadzo Mugodo, Tilahun S. Workneh 2021

机译：薄层干燥和芒果切片建模的动力学及不同热风干燥方法对质量的影响及影响
7. Preparation of thin solid electrolyte by hot-pressing and diamond wire slicing [O] . Masashi Kotobuki, Houhua Lei, Yu Chen, 2019

机译：通过热压和金刚石线切割制备薄固体电解质
8. Silicon Ingot Casting: Heat Exchange Method (Hem). Multi-Wire Slicing: Fixed Abrasive Slicing Technique (Fast). Phase 3 and Phase 4: Silicon Sheet Growth Development for the Large Area Sheet Task of the Low-Cost Solar Array Projec [R] . Schmid, F., Khattak, C. P. 1982

机译：硅锭铸造：换热方法（下摆）。多线切片：固定磨料切片技术（快速）。第3阶段和第4阶段：低成本太阳能阵列项目大面积工作板的硅片增长开发

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