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A Device-Level Vacuum-Packaging Scheme for Microbolometers on Rigid and Flexible Substrates

机译：用于刚性和柔性基板上的微测辐射热计的设备级真空包装方案

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Purdue E-pubs; Ncn Publications; Aamer Mahmood; Donald P. Butler; Student Member; Senior Member; Zeynep Çelik-butler;
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1. A Device-Level Vacuum-Packaging Scheme for Microbolometers on Rigid and Flexible Substrates [J] . Mahmood A., Butler D. P., 脟elik-Butler Z. IEEE sensors journal . 2007,第7期

机译：刚性和柔性基板上的微辐射热计的设备级真空包装方案
2. Device-level vacuum packaged uncooled microbolometer on a polyimide substrate [J] . Ahmed Moinuddin, Butler Donald P., Celik-Butler Zeynep Infrared physics and technology . 2016,第Null期

机译：聚酰亚胺衬底上的设备级真空包装的未冷却测微辐射热计
3. Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part I. Flip-Chip Bonding on Rigid Substrates [J] . Park Donghyun, Oh Tae Sung Materials transactions . 2017,第8期

机译：刚性，柔性和可拉伸基板上的倒装芯片粘接特性的比较：I部分。刚性基板上的倒装芯片粘合
4. Geometric optimization of high performance interconnect of Rigid/Flexible/Rigid substrate for Wafer Level Packaging in Solid State Lighting applications by numerical simulations [C] . Liu P., Zhang J., Sokolovskij R., International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems . 2013

机译：通过数值模拟对用于晶圆级封装的固态/柔性/刚性基板的高性能互连进行几何优化
5. Device level vacuum packaged microbolometers on flexible substrates. [D] . Mahmood, Aamer. 2006

机译：在柔性基板上的设备级真空包装的微辐射热计。
6. Flexible-to-rigid transition is central for substrate transport in the ABC transporter BmrA from Bacillus subtilis [O] . Denis Lacabanne, Cédric Orelle, Lauriane Lecoq, 2019

机译：柔性到刚性的过渡是枯草芽孢杆菌ABC转运蛋白BmrA中底物转运的中心
7. Device-level vacuum packaged uncooled microbolometer on a polyimide substrate [O] . Moinuddin Ahmed, Donald P. Butler, Zeynep Celik-Butler 2016

机译：聚酰亚胺基材上的装置级真空包装的未冷却微生物计

A Device-Level Vacuum-Packaging Scheme for Microbolometers on Rigid and Flexible Substrates

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