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Glyoxylic Acid as Reducing Agent for Electroless Copper Deposition on Cobalt Liner

机译：乙醛酸作为钴衬上化学镀铜的还原剂

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Fumihiro Inouea; Harold Philipsena; Marleen H. Van Der Veena; Stefaan Van; Silvia Arminia; Herbert Struyfa; Shoso Shingubarac; Tetsu Tanakab;
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1. Electroless Copper Deposition Using Glyoxylic Acid as Reducing Agent for Ultralarge Scale Integration Metallization [J] . Yosi Y. Shacham-Diamand Electrochemical and solid-state letters . 2000,第6期

机译：乙醛酸为还原剂的超大规模集成金属化学镀铜
2. Preparation of Copper-coated Polyester Fabric via Electroless Plating Using Glyoxylic Acid as Reducing Agent [J] . Wenfeng Qin, Ronghui Guo Journal of fiber bioengineering and informatics . 2015,第2期

机译：乙醛酸为还原剂的化学镀法制备铜包覆聚酯织物
3. Kinetics of electroless copper deposition using cobalt(II)-ethylenediamine complex compounds as reducing agents [J] . Vaskelis A., Norkus E., Jaciauskiene J. Journal of Applied Electrochemistry . 2002,第3期

机译：使用钴（II）-乙二胺络合物作为还原剂进行化学镀铜的动力学
4. Glyoxylic Acid as Reducing Agent for Electroless Copper Deposition on Cobalt Liner [C] . Fumihiro Inoue, Harold Philipsen, Marleen H. van der Veen, Meeting of The Electrochemical Society . 2015

机译：拟亚氧基乙酸作为化学镀铜铜沉积的还原剂
5. Hardness characteristics of cobalt/chromium and nickel/chromium by electrodeposition or electroless deposition. [D] . Chen, Wei. 2005

机译：通过电沉积或化学沉积形成的钴/铬和镍/铬的硬度特性。
6. Electroless Platinum Deposition Using Co3+/Co2+ Redox Couple as a Reducing Agent [O] . Loreta Tamasauskaite-Tamasiunaite, Yezdi Dordi, Eugenijus Norkus, 2021

机译：使用CO3 + / CO2 +氧化还原耦合作为还原剂的化学铂沉积
7. Deposition Process of Electroless Copper Plating Using Glyoxylic Acid as a Reducing Agent. [O] . Hiroyuki WATANABE, Kunio CHIBA, Yutaka HUKUDA, 1995

机译：用乙醛酸作为还原剂沉积化学镀铜工艺。

Glyoxylic Acid as Reducing Agent for Electroless Copper Deposition on Cobalt Liner

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