首页> 外文OA文献 >Simplified Cleaning for a-Si:H passivation of wafers bonded to glass

【2h】

Simplified Cleaning for a-Si:H passivation of wafers bonded to glass

机译：a-si的简化清洗：粘合到玻璃上的晶圆的H钝化

页面导航

著录项
相似文献
相关主题

著录项

作者
Stefano N. Granata; T. Bearda; I. Gordon; Y. Abdulraheem;
展开▼
作者单位

展开▼
年度 2016
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Simplified Cleaning for a-Si:H passivation of wafers bonded to glass [J] . Stefano N. Granata, T. Bearda, I. Gordon, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2015,第Null期

机译：简化清洁粘结到玻璃的晶圆的a-Si：H钝化的过程
2. Role of O_2 radicals on silicone plasma treatments for a-Si:H surface passivation of PV wafers bonded to glass [J] . Stefano Nicola Granata, Alessio Marchegiani, Twan Bearda, Physica status solidi . 2015,第9期

机译：O_2自由基在硅等离子处理玻璃粘合的PV晶片的a-Si：H表面钝化中的作用
3. Development of a-Si:H/c-Si heterojunctions for the i~2-module concept: Low-temperature passivation and emitter formation on wafers bonded to glass [J] . Govaerts J., Nicola Granata S., Bearda T., Solar Energy Materials and Solar Cells: An International Journal Devoted to Photovoltaic, Photothermal, and Photochemical Solar Energy Conversion . 2013,第Null期

机译：用于i〜2组件概念的a-Si：H / c-Si异质结的开发：低温钝化和在与玻璃粘合的晶圆上形成发射极
4. Simplified Cleaning for a-Si:H passivation of wafers bonded to glass [C] . Stefano N. Granata, T. Bearda, I.Gordon, International symposium on ultra clean processing of semiconductor surfaces . 2015

机译：简化清洁粘结到玻璃的晶圆的a-Si：H钝化的过程
5. The Effect of Offcut Angle on Electrical Conductivity of Direct Wafer-Bonded n-Gallium Arsenide/n-Gallium Arsenide Structures for Wafer-Bonded Tandem Solar Cells [D] . Yeung, King Wah Sunny 2012

机译：切角对晶片键合串联太阳能电池直接晶片键合的n-砷化镓/ n-砷化镓结构电导率的影响
6. Improvement of Electrical Performance in P-Channel LTPS Thin-Film Transistor with a-Si:H Surface Passivation [O] . Kyungsoo Jang, Youngkuk Kim, Pham Duy Phong, 2019

机译：具有a-Si：H表面钝化的P沟道LTPS薄膜晶体管的电性能改善
7. Wafer-level Fabrication of Ball Lens by Cross-cut and Reflow of Wafer-bonded Glass on Silicon [O] . Dong-Whan Lee, Jin-Kyung Oh, Jun-Seok Choi, 2010

机译：硅片粘合玻璃晶晶晶级制造硅芯片
8. Wafer Cleaning and Pre-Bonding Module for Wafer Bonding [R] . Mishra, U., Witt, G. L. 2007

机译：用于晶圆键合的晶圆清洗和预粘接模块

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

客服微信
服务号