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The Effect of Die Attach Layer Delamination on the Thermal Performance of Plastic Packages

机译：模具贴装层脱层对塑料封装热性能的影响

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Asif Chowdhury; Bruce Guenin; Chanhee Woo; Seungmo Kim; Seri Lee;
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年度 2008
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1. A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow [J] . Tay A.A.O., Goh K.Y. IEEE transactions on device and materials reliability . 2003,第4期

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2. Enhancement of optical performance of the light emitting diode packages with advanced thermal design of die-attaching layers [J] . Kunmo Chu, Changseung Lee, Sung-Hoon Park, Journal of materials science . 2017,第7期

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3. Adhesive die attach for power application: Performance and reliability in plastic package [J] . R. Tiziani, G. passoni, G. Santospirito Microelectronics & Reliability . 2002,第9a11期

机译：适用于电源应用的粘胶模头：塑料封装的性能和可靠性
4. A comparison of the effect of die attach layer delamination on thermal performance of standard and thermally enhanced plastic packages [C] . Asif R. Chowdhury, Seung Mo Kim, Hee Yeoul Yoo, International symposium on electronic packaging technology . 1998

机译：模具层分层对标准和热增强塑料包装热性能影响的比较
5. The effect of die attach voiding on the thermal resistance of integrated circuit package [D] . Chang, Li-hsin. 1987

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6. Effect of Hybrid Talc-Basalt Fillers in the Shell Layer on Thermal and Mechanical Performance of Co-Extruded Wood Plastic Composites [O] . Runzhou Huang, Changtong Mei, Xinwu Xu, 2015

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7. Shadowgraph studies of laser-assisted non-thermal structuring of thin layers on flexible substrates by shock-wave-induced delamination processes [O] . Lorenz Pierre, Smausz Tomi, Csizmadia Tamás, 2015

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The Effect of Die Attach Layer Delamination on the Thermal Performance of Plastic Packages

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