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Application of a Model-free Algorithm for the Packing of Irregular Shaped Objects in Semiconductor Manufacture

机译：无模型算法在半导体制造中不规则形状物体包装中的应用

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Vivek A. Sujan; Steven Dubowsky;
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年度 2007
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1. Robotic Manipulation of Highly Irregular Shaped Objects: Application to a Robot Crucible Packing System for Semiconductor Manufacture [J] . Vivek A. Sujan, Steven Dubowsky, Yoshiaki Ohkami Journal of Manufacturing Processes . 2002,第1期

机译：高度不规则形状物体的机器人操纵：在半导体制造机器人坩埚包装系统中的应用
2. A branch & bound algorithm for cutting and packing irregularly shaped pieces [J] . R. Alvarez-Valdes, A. Martinez, J.M. Tamarit International journal of production economics . 2013,第2期

机译：用于切割和包装不规则形状的块的分支定界算法
3. Optimal design approach for heating irregular-shaped objects in three-dimensional radiant furnaces using a hybrid genetic algorithm-artificial neural network method [J] . Darvishvand Leila, Kamkari Babak, Kowsary Farshad Engineering Optimization . 2018,第1a3期

机译：利用杂交遗传算法 - 人工神经网络方法加热三维辐射炉中不规则形物体的最优设计方法
4. Application of a model-free algorithm for the packing of irregular shaped objects in semiconductor manufacture [C] . Sujan, V.A., Dubowsky, Robotics and Automation, 2000. Proceedings. ICRA '00. IEEE International Conference on . 2000

机译：无模型算法在不规则形状物体包装中的应用
5. Solving partial differential equations on irregular domains with moving interfaces, with applications to superconformal electrodeposition in semiconductor manufacturing. [D] . Shan, Ying. 2007

机译：求解具有运动界面的不规则区域上的偏微分方程，并将其应用于半导体制造中的超共形电沉积。
6. Packing of large-scale chromatography columns with irregularly shaped glass based resins using a stop-flow method [O] . Sun Chau Siu, Celeste Chia, Yanglin Mok, -1

机译：使用停流法用不规则形状的玻璃基树脂填充大型色谱柱
7. The Design of a 3-D Surface Geometry Acquisition System for Highly Irregular Shaped Objects: with Application to CZ Semiconductor Manufacture [O] . Vivek A. Sujan, Steven Dubowski 2007

机译：高不规则形状物体三维表面几何采集系统的设计及其在CZ半导体制造中的应用

Application of a Model-free Algorithm for the Packing of Irregular Shaped Objects in Semiconductor Manufacture

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