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Routing Algorithms for Multi-Chip Modules

机译：多芯片模块的路由算法

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Jens Lienig; K. Thulasiraman; M. N. S. Swamy;
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年度 2008
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1. AN OVERVIEW OF PLACEMENT AND ROUTING ALGORITHMS FOR MULTI-CHIP MODULES [J] . Subhomoy Chattopadhyay, Donald W. Bouldin, Peyman H. Dehkordi International Journal of High Speed Electronics and Systems: Devices, Integrated Circuits and Systems, Optical and Quantum Electronics . 1995,第3期

机译：多芯片模块的布局和布线算法概述
2. OPTIMAL ALGORITHMS FOR SUBSTRATE TESTING IN MULTI-CHIP MODULES [J] . Andrew B. Kahng, Gabriel Robins, Elizabeth A. Walkup International Journal of High Speed Electronics and Systems: Devices, Integrated Circuits and Systems, Optical and Quantum Electronics . 1995,第4期

机译：多芯片模块中基板测试的最佳算法
3. PIN REDISTRIBUTION PROBLEM FOR MULTI-CHIP MODULES: ALGORITHMS AND COMPLEXITY [J] . Douglas Chang, Teofilo F. Gonzalez International Journal of High Speed Electronics and Systems: Devices, Integrated Circuits and Systems, Optical and Quantum Electronics . 1995,第3期

机译：多芯片模块的PIN分配问题：算法和复杂性
4. Routing algorithms for multi-chip modules [C] . Jens Lienig, K. Thulasiraman, M. N. S. Swamy 21st annual conference of the Australian Computer-Human Interaction Special Interest Group 2009 . 2009

机译：多芯片模块的路由算法
5. Experimental Study of Novel Materials and Module for Cryogenic (4K) Superconducting Multi-Chip Modules. [D] . John, Ranjith Samuel E. 2012

机译：低温（4K）超导多芯片模块的新型材料和模块的实验研究。
6. Thermal Impedance Characterization Using Optical Measurement Assisted by Multi-Physics Simulation for Multi-Chip SiC MOSFET Module [O] . Min-Ki Kim, Sang Won Yoon 2020

机译：多芯片SIC MOSFET模块多物理仿真辅助光学测量的热阻抗表征
7. An Overview of Placement and Routing Algorithms for Multi-Chip Modules [O] . Subhomoy Chattopadhyay, Donald W. Bouldin, Peyman H. Dehkordi 2007

机译：多芯片模块的布局和布线算法综述

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