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A Three-Layer 3-D Silicon System Using Through-Si Vertical Optical Interconnections and Si CMOS Hybrid Building Blocks

机译：采用贯通si垂直光互连和si CmOs混合构建模块的三层三维硅系统

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Steven W. Bond; Olivier Vendier; Myunghee Lee; Sungyong Jung; Georgianna Dagnall; Martin Brooke; Nan Marie Jokerst; Senior Member; D. Scott Wills; April Brown;
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年度 2008
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1. A three-layer 3D silicon system using through-Si vertical optical interconnections and Si CMOS hybrid building blocks [J] . Bond S.W., Vendier O. IEEE journal of selected topics in quantum electronics . 1999,第2期

机译：三层3D硅系统，使用直通硅垂直光学互连和Si CMOS混合构建模块
2. A three-layer 3D silicon system using through-Si vertical opticalinterconnections and Si CMOS hybrid building blocks [J] . Bond S.W., Vendier O., Lee M., IEEE journal of selected topics in quantum electronics . 1999,第2期

机译：三层3D硅系统，使用直通硅垂直光学互连和Si CMOS混合构建模块
3. Heterogeneous Integration of a 300-mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-Last 3-D Interconnection [J] . Colin McDonough, Doug La Tulipe, Dan Pascual, Journal of Microelectronics and Electronic Packaging . 2016,第2期

机译：通过直接氧化物粘接和通孔 - 最后3-D互连通过直接氧化物粘接和通过最后3-D互连的非均相集成
4. A comparison of CMOS chip to chip interconnections: vertical optical through-Si links versus high density electrical interconnect [C] . Brooke, M., Jokerst, . 1998

机译：CMOS芯片与芯片互连的比较：垂直光学直通硅链路与高密度电互连
5. Compact modeling of Silicon Carbide (SIC) Vertical Junction Field Effect Transistor (VJFET) in PSpice using Angelov model and PSpice simulation of analog circuit building blocks using SIC VJFET model. [D] . Purohit, Siddharth. 2006

机译：使用Angelov模型在PSpice中对碳化硅（SIC）垂直结场效应晶体管（VJFET）进行紧凑建模，并使用SIC VJFET模型对PSpice模拟电路构建模块进行仿真。
6. The Open System Interconnection as a building block in a health sciences information network. [O] . R W Boss 1985

机译：开放系统互连是健康科学信息网络中的基石。
7. A three-layer 3-D silicon system using through-Si vertical optical interconnections and SiCMOS hybrid building blocks [O] . Bond Steve W., Vendier Olivier, Lee Myunghee, 2015

机译：三层3-D硅系统，使用直通硅垂直光学互连和SiCMOS混合构造块

A Three-Layer 3-D Silicon System Using Through-Si Vertical Optical Interconnections and Si CMOS Hybrid Building Blocks

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