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The Physical and Electrical Effects of Metal-Fill Patterning Practices for Oxide Chemical-Mechanical Polishing Processes

机译：金属填充图案实践对氧化物化学机械抛光过程的物理和电学效应

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Brian E. Stine; Duane S. Boning; James E. Chung; Lawrence Camilletti; Frank Kruppa; Edward R. Equi; William Loh; Sharad Prasad; Moorthy Muthukrishnan; Daniel Towery; Michael Berman; Ashook Kapoor;
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年度 1998
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1. The physical and electrical effects of metal-fill patterning practices for oxide chemical-mechanical polishing processes [J] . Stine B.E., Boning D.S. IEEE Transactions on Electron Devices . 1998,第3期

机译：氧化物化学机械抛光工艺中金属填充图案实践的物理和电效应
2. Pattern Density and Deposition Profile Effects on Oxide Chemical-Mechanical Polishing and Chip-Level Modeling [J] . Y.B. Park, I.Y. Yoon, H.H. Ryu, Journal of Electronic Materials . 2001,第12期

机译：图案密度和沉积轮廓对氧化物化学机械抛光和芯片级建模的影响
3. Analyses and experimental confirmation of removal performance of silicon oxide film in the chemical-mechanical polishing (CMP) process with pattern geometry of concentric groove pads [J] . Chin-Chung Wei, Jeng-Haur Horng, An-Chen Lee, Wear: an International Journal on the Science and Technology of Friction, Lubrication and Wear . 2011,第3a4期

机译：具有同心凹槽垫图案几何形状的化学机械抛光（CMP）过程中氧化硅膜去除性能的分析和实验确认
4. MODELING OF PATTERN DEPENDENCIES FOR MULTI-LEVEL COPPER CHEMICAL-MECHANICAL POLISHING PROCESSES [C] . Tamba Tugbawa, Tae Park, Brian Lee, Symposium on Chemical-Mechanical Polishing 2001-Advances and Future Challenges, Apr 18-20, 2001, San Francisco, California . 2001

机译：多级铜化学机械抛光工艺的图案依赖性模型
5. Nitrogen oxides formation through electrical processes in the middle atmosphere and subsequent effects on ice crystals [D] . Peterson, Harold S. 2008

机译：在中层大气中通过电气过程形成的氮氧化物及其对冰晶的后续影响
6. Associations between physical activity patterns and dietary patterns in a representative sample of Polish girls aged 13-21 years: a cross-sectional study (GEBaHealth Project) [O] . Lidia Wadolowska, Joanna Kowalkowska, Marta Lonnie, 2016

机译：一项代表性研究（13到21岁的波兰女孩）中的体育活动模式与饮食模式之间的关联：一项横断面研究（GEBaHealth项目）
7. Modeling of Pattern Dependencies for Multi-Level Copper Chemical-Mechanical Polishing Processes [O] . Tamba Tugbawa, Tae Park, Brian Lee, 2001

机译：多层铜化学机械抛光工艺的图案相关性建模
8. Defect centers in chemical-mechanical polished MOS oxides [R] . Shaneyfelt, M. R. , Warren, W. L. , Hetherington, D. L. , 1994

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The Physical and Electrical Effects of Metal-Fill Patterning Practices for Oxide Chemical-Mechanical Polishing Processes

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