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Genetic Algorithm based Resistive Susceptor Design for Uniform Heating During the Induction Bonding Process

机译：基于遗传算法的感应粘接过程均匀加热电阻式受体设计

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R. Mathur; S. G. Advani; S. Yarlagadda; B. K. Fink;
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年度 2003
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1. Genetic Algorithm based Resistive Susceptor Design for Uniform Heating During the Induction Bonding Process [J] . R.Mathur, S.G.Advani, S.Yarlagadda, Journal of Thermoplastic Composite Materials . 2003,第6期

机译：基于遗传算法的感应结合过程中均匀加热的电阻感受器设计
2. OPTIMAL DESIGN FOR INDUCTION HEATING USING GENETIC ALGORITHMS [J] . TEODOR LEUCA, STEFAN NAGY, NISTOR DANIEL TRIP, Revue roumaine des sciences techniques . 2015,第2期

机译：基于遗传算法的感应加热的优化设计
3. Optimal design of heating channels for rapid heating cycle injection mold based on response surface and genetic algorithm [J] . Xi-Ping Li, Guo-Qun Zhao, Yan-Jin Guan, Materials & design . 2009,第10期

机译：基于响应面和遗传算法的快速加热循环注射模具加热通道的优化设计
4. OPTIMAL DESIGN OF AN INDUCTION HEATING DEVICE USING GENETIC ALGORITHMS AND SIMULATED ANNEALING [C] . NOVAC Mihaela, VLADU Ecaterina, NOVAC Ovidiu, DAAAM International Symposium on Intelligent Manufacturing and Automation . 2017

机译：遗传算法和模拟退火的感应加热装置的最佳设计
5. A Parallel Processing and Diversified-Hidden-Gene-Based Genetic Algorithm Framework for Fuel-Optimal Trajectory Design for Interplanetary Spacecraft Missions [D] . Somavarapu, Dhathri H. 2017

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6. QSAR Models for CXCR2 Receptor Antagonists Based on the Genetic Algorithm for Data Preprocessing Prior to Application of the PLS Linear Regression Method and Design of the New Compounds Using In Silico Virtual Screening [O] . Tahereh Asadollahi, Shayessteh Dadfarnia, Ali Mohammad Haji Shabani, 2011

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7. A Novel Design Method for Optimizing an Indirect Forced Circulation Solar Water Heating System Based on Life Cycle Cost Using a Genetic Algorithm [O] . Myeong Jin Ko 2015

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8. Design of a Resistive Susceptor for Uniform Heating During Induction Bonding of Composites [R] . Fink, B. K. , Yarlagadda, S. , Gillespie, J. W. 2000

机译：复合材料感应粘接过程中均匀加热电阻式受体的设计

Genetic Algorithm based Resistive Susceptor Design for Uniform Heating During the Induction Bonding Process

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