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Numerical simulation of micro-assembly of MEMS devices and post assembly electromechanical actuation

机译：MEMS装置的微装配和装配后机电驱动的数值模拟

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Daniel Keating Yie; Daniel J. Keating; Yie He; Nora Finch; James Marchetti;
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年度 2007
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1. In-package MEMS-based thermal actuators for micro-assembly [J] . Henneken VA, Tichem M, Sarro PM Journal of Micromechanics and Microengineering . 2006,第6期

机译：基于封装的基于MEMS的热执行器，用于微装配
2. In-package MEMS-based thermal actuators for micro-assembly [J] . V. A. Henneken, M. Tichem, P. M. Sarro Journal of Micromechanics and Microengineering . 2006,第6期

机译：基于封装的基于MEMS的热执行器，用于微装配
3. Experimental Validation of Mixed Electromechanical and Electromagnetic Modeling of RF-MEMS Devices Within a Standard IC Simulation Environment [J] . Iannacci J., Gaddi R., Gnudi A. Microelectromechanical Systems, Journal of . 2010,第3期

机译：在标准IC仿真环境中RF-MEMS器件的机电混合模型的实验验证
4. Numerical simulation of micro-assembly of MEMS devices and post assembly electromechanical actuation [C] . Daniel J. Keating, Yie He, Nora Finch, Conference on Design, Modeling, and Simulation in Microelectronics Nov 28-30, 2000 Singapore . 2000

机译：MEMS器件的微装配和装配后机电驱动的数值模拟
5. Numerical simulation and experiments of fatigue crack growth in multi-layer structures of MEMS and microelectronic devices. [D] . Wang, Bo. 2007

机译：MEMS和微电子器件多层结构中疲劳裂纹扩展的数值模拟和实验。
6. Micro Electromechanical Systems (MEMS) Based Microfluidic Devices for Biomedical Applications [O] . Muhammad Waseem Ashraf, Shahzadi Tayyaba, Nitin Afzulpurkar 2011

机译：基于微机电系统（MEMS）的生物医学应用微流控设备
7. In-package MEMS-based thermal actuators for micro-assembly [O] . V A Henneken, M Tichem, P M Sarro 2006

机译：用于微组件的包装内基于MEMS的热致动器
8. Numerical Simulation and Experiments of Fatigue Crack Growth in Multi- Layer Structures of MEMS and Microelectronic Devices [R] . Siegmund, T. H. 2006

机译：mEms和微电子器件多层结构疲劳裂纹扩展的数值模拟与实验

Numerical simulation of micro-assembly of MEMS devices and post assembly electromechanical actuation

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