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Flip Chip Power MOSFET: A New Wafer Scale Packaging Technique

机译：倒装芯片功率MOSFET：新型晶圆级封装技术

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Aram Arzumanyan; Ritu Sodhi; Dan Kinzer; Hazel Schofield; Tim Sammon;
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年度 2010
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1. Thin-Film-Flip-Chip LEDs Grown on Si Substrate Using Wafer-Level Chip-Scale Package [J] . Keon Hwa Lee, Mojtaba Asadirad, Shahab Shervin, IEEE Photonics Technology Letters . 2016,第18期

机译：使用晶圆级芯片级封装在Si基板上生长的薄膜倒装芯片LED
2. Visible Light-Emitting Diodes With Thin-Film-Flip- Chip-Based Wafer-Level Chip-Scale Package Technology Using Anisotropic Conductive Film Bonding [J] . Lee Keon Hwa, Kim Seung Hwan, Lim Woo-Sik, Electron Device Letters, IEEE . 2015,第7期

机译：基于薄膜倒装芯片的晶圆级晶片级封装技术的各向异性发光二极管键合技术的可见光发光二极管
3. Inspection of Flip Chip and Chip Scale Package Interconnects Using Laser Ultrasound and Interferometric Techniques [J] . Turner Howard, Dathan Erdahl, I. Charles Ume, International Journal of Microcircuits & Electronic Packaging . 2002,第1期

机译：使用激光超声和干涉技术检查倒装芯片和芯片级封装互连
4. Flip chip power MOSFET: a new wafer scale packaging technique [C] . Arzumanyan A., Sodhi R., Kinzer D., 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface . 2006

机译：倒装芯片功率MOSFET：新的晶圆级封装技术
5. Fabrication of CZTS solar cells by sputtering method An experimental technique to measure the resistance change of ITO thin film during cyclic bending Reliability study of wafer level chip scale package using board level drop test. [D] . Ramesh, Dasharathy N. 2013

机译：溅射法制备CZTS太阳能电池循环弯曲过程中测量ITO薄膜电阻变化的实验技术使用板级跌落试验研究晶圆级芯片规模封装的可靠性。
6. Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems [O] . Kenji Okabe, Horagodage Prabhath Jeewan, Shota Yamagiwa, 2015

机译：用于无线供电的神经接口系统的薄膜柔性天线和硅CMOS整流器芯片的协同设计方法和晶圆级封装技术
7. Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems [O] . Kenji Okabe, Horagodage Prabhath Jeewan, Shota Yamagiwa, 2015

机译：用于无线供电神经接口系统的薄膜柔性天线和硅CmOs整流器芯片的协同设计方法和晶圆级封装技术
8. Batch Wafer Scale LIGA Assembly and Packaging Technique vai Diffusion Bonding [R] . Christenson, T. R. , Schmale, D. T. 1999

机译：批量晶圆规模LIGa组装和封装技术vai扩散连接

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