Process optimisation of transfer moulding for electronic packages using artificial neural networks and multiobjective optimisation techniques

摘要

Transfer moulding is the most common process for the encapsulation of electronic packages in semiconductor manufacturing. Quality of the moulding is affected by a large number of mould design parameters and process parameters. Currently, the parameters setting is performed by experienced engineers in a trial and error manner and often the optimal setting can not be obtained. In the face of global competition, the current practice is inadequate. In this research, a process optimisation system for transfer moulding of electronic packages is described which involves design of experiments (DOE) techniques, artificial neural networks (ANNs), multiple regression analysis and the minimax method. The system is aimed to determine the optimal mould design parameters and process parameter settings of transfer moulding of electronic packages for multiobjective problem. Implementation of the optimisation system has demonstrated that the time for the determination of optimal mould design parameters and process parameters setting can be greatly reduced and the parameters setting recommended by the system can contribute to the good quality of moulded packages without relying on experienced engineers.