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Study of GaN thin films grown on intermediate-temperature buffer layers by molecular beam epitaxy

机译:用分子束外延研究在中温缓冲层上生长的GaN薄膜

摘要

A detailed characterisation study of GaN thin films grown by rf-plasma molecular beam epitaxy on intermediate-temperature buffer layers (ITBL) was carried out with Hall, photoluminescence (PL) and deep-level transient Fourier spectroscopy (DLTFS) techniques. The unique feature of our GaN thin films is that the GaN epitaxial layers are grown on top of a double layer that consists of an ITBL, which is grown at 690°C, and a conventional low-temperature buffer layer deposited at 500°C. It is observed that the electron mobility increases steadily with the thickness of the ITBL, which peaks at 377 cm2V-1s-1 for an ITBL thickness of 800 nm. The PL also demonstrated systematic improvements with the thickness of the ITBL. The DLTFS results suggest a three-order-of-magnitude reduction in the deep level at Ec-0.40 eV in the device fabricated with the GaN films grown on an ITBL thickness of 1.25 μm in comparison with the control device without an ITBL. Our analyses indicate that the utilization of an ITBL in addition to the conventional low-temperature buffer layer leads to the relaxation of residual strain within the material, resulting in an improvement in the optoelectronic properties of the films.
机译:利用霍尔,光致发光(PL)和深层瞬态傅里叶光谱(DLTFS)技术,对通过rf等离子体分子束外延在中温缓冲层(ITBL)上生长的GaN薄膜进行了详细的表征研究。我们的GaN薄膜的独特之处在于,GaN外延层生长在双层结构上,该双层结构由在690°C下生长的ITBL和在500°C下沉积的常规低温缓冲层组成。观察到电子迁移率随ITBL的厚度稳定增加,对于800 nm的ITBL厚度,其峰值在377 cm2V-1s-1处。 PL还展示了ITBL厚度的系统改进。 DLTFS结果表明,与不具有ITBL的控制器件相比,在以1.25μm的ITBL厚度生长GaN膜的情况下制造的器件中,Ec-0.40 eV处的深能级降低了三个数量级。我们的分析表明,除了传统的低温缓冲层之外,ITBL的使用还可以缓解材料内的残余应变,从而改善薄膜的光电性能。

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