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Novel silica tube/polyimide composite films with variable low dielectric constant

机译:低介电常数可变的新型石英管/聚酰亚胺复合薄膜

摘要

The synthesis of silica tubes (ST) by self-assembly and preparation of the ST/PI composite films by mixing the ST and polyimides (PI) precursors in a solution of N,N-dimethylacetamide (DMAc) were discussed. The mixture was thermally imidized from 50 to 300°C to form ST/PI composite films. The dielectric constant of the composite was reduced from about 3.3 for pure PI to 2.9 for the 3 wt.- % ST/PI composite. Analysis shows that the low dielectric constant is ascribed to the effect of air stored in the silica tubes, pores and interfaces between the ST and the PI matrix in the composite.
机译:讨论了通过自组装合成二氧化硅管(ST)以及通过在N,N-二甲基乙酰胺(DMAc)溶液中混合ST和聚酰亚胺(PI)前驱体来制备ST / PI复合膜的方法。在50至300℃下将混合物热酰亚胺化以形成ST / PI复合膜。复合物的介电常数从纯PI的约3.3降低到3 wt。%ST / PI复合物的2.9。分析表明,低介电常数归因于储存在二氧化硅管中的空气,复合材料中ST和PI基质之间的孔和界面的影响。

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