Embedded components in printed circuit boards : a processing technology review

摘要

It is evident that embedded passive components (EPCs) allow packaging substrate miniaturization and have the potential to reduce costs. Moreover, they exhibit superior electrical behaviour with respect to the minimization of parasitic effects. However, as for most emerging technologies, there is no well-established process or method for EPCs that lead to the desired result, but many have been and are still being investigated. This article attempts to review the state of the art of resistor and capacitor EPCs, including an assessment of the pros and cons of the various technologies pursued.